MC9S08LL36CLK Freescale Semiconductor, MC9S08LL36CLK Datasheet - Page 40

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MC9S08LL36CLK

Manufacturer Part Number
MC9S08LL36CLK
Description
IC MCU 8BIT 36KB FLASH 80LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r

Specifications of MC9S08LL36CLK

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LCD, LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
36KB (36K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-LQFP
Processor Series
S08LL
Core
HCS08
3rd Party Development Tools
EWS08
Development Tools By Supplier
TWR-SER, TWR-ELEV, TWR-S08LL64, TWR-SENSOR-PAK, TWR-S08LL64-KIT, TWR-LCD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08LL36CLK
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1
2
3
4
5
EMC Performance
3.16
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263,
AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
3.16.1
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East).
4
This appendix contains ordering information for the device numbering system MC9S08LL64 and
MC9S08LL36 devices. See
40
No.
These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for
calculating approximate time to program and erase.
The program and erase currents are additional to the standard run I
V
Typical endurance for Flash was evaluated for this product family on the 9S12Dx64. For additional information on how
Freescale defines typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to
25 °C using the Arrhenius equation. For additional information on how Freescale defines typical data retention, please refer to
Engineering Bulletin EB618, Typical Data Retention for Nonvolatile Memory.
10
11
12
The frequency of this clock is controlled by a software setting.
DD
= 3.0 V, bus frequency = 4.0 MHz.
C
D
C
C
EMC Performance
Ordering Information
Radiated Emissions
Page erase current
Program/erase endurance
Data retention
T
T = 25°C
L
to T
H
= –40°C to 85°C
Characteristic
5
Table 1
Table 21. Flash Characteristics (continued)
3
MC9S08LL64 Series MCU Data Sheet, Rev. 5
for feature summary by package information.
4
Symbol
R
t
IDDPE
D_ret
DD
. These values are measured at room temperatures with
10,000
Min
15
100,000
Typical
100
6
Freescale Semiconductor
Max
cycles
years
Unit
mA

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