MC9S08GT60ACFDE Freescale Semiconductor, MC9S08GT60ACFDE Datasheet - Page 116

IC MCU 60K FLASH 4K RAM 48-QFN

MC9S08GT60ACFDE

Manufacturer Part Number
MC9S08GT60ACFDE
Description
IC MCU 60K FLASH 4K RAM 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08GT60ACFDE

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
Processor Series
S08GT
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
4 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Operating Supply Voltage
0 V to 1.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
M68EVB908GB60E, M68DEMO908GB60E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08GT60ACFDE
Manufacturer:
NXP
Quantity:
1 000
Part Number:
MC9S08GT60ACFDE
Manufacturer:
NXP
Quantity:
1 000
Internal Clock Generator (S08ICGV2)
The following sections contain initialization examples for various configurations.
Important configuration information is repeated here for reference.
116
1
The IRG typically consumes 100 μA. The FLL and DCO typically consumes 0.5 to 2.5 mA, depending upon output frequency.
For minimum power consumption and minimum jitter, choose N and R to be as small as possible.
Bypassed
Engaged
1
SCM — self-clocked mode (FLL bypassed
internal)
FBE — FLL bypassed external
FEI — FLL engaged internal
FEE — FLL engaged external
FLL
FLL
Ensure that
Hexadecimal values designated by a preceding $, binary values designated
by a preceding %, and decimal values have no preceding character.
FEI
4 MHz < f
Medium power (will be less than FEE if oscillator
range = high)
Medium clock accuracy (After IRG is trimmed)
Lowest system cost (no external components
required)
IRG is on. DCO is on.
SCM
This mode is mainly provided for quick and reliable
system startup.
3 MHz < f
3 MHz < f
Medium power
Poor accuracy.
IRG is off. DCO is on and open loop.
Clock Scheme
f
ICGDCLK
Clock Reference Source = Internal
Bus
Bus
Bus
, which is equal to
< 20 MHz.
< 5 MHz (default).
< 20 MHz (via filter bits).
Table 7-4. ICGOUT Frequency Calculation Options
Table 7-3. ICG Configuration Consideration
1
MC9S08GB60A Data Sheet, Rev. 2
f
ICGOUT
(f
IRG
f
ext
f
ICGDCLK
f
/ 7)* 64*N / R
* R, does not exceed f
ICGOUT
f
* P * N / R
ext
NOTE
/ R
/ R
1
Range = 0 ; P = 64
FEE
4 MHz < f
Medium power (will be less than FEI if oscillator
range = low)
Good clock accuracy
Medium/High system cost (crystal, resonator or
external clock source required)
IRG is off. DCO is on.
FBE
f
used.
Lowest power
Highest clock accuracy
Medium/High system cost (Crystal, resonator or
external clock source required)
IRG is off. DCO is off.
Range = 1; P = 1
Bus
range <= 8 MHz when crystal or resonator is
Clock Reference Source = External
ICGDCLKmax.
NA
NA
64
P
Bus
< 20 MHz
Typical f
8 MHz out of reset
Typical f
Freescale Semiconductor
Note
IRG
ICGOUT
= 243 kHz
=

Related parts for MC9S08GT60ACFDE