MC9S08GT60CFD Freescale Semiconductor, MC9S08GT60CFD Datasheet - Page 279

no-image

MC9S08GT60CFD

Manufacturer Part Number
MC9S08GT60CFD
Description
MCU 8BIT 60K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08GT60CFD

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08GT60CFDE
Manufacturer:
ON
Quantity:
130
Part Number:
MC9S08GT60CFDE
Manufacturer:
FREESCALE
Quantity:
1 831
Part Number:
MC9S08GT60CFDE
Manufacturer:
FREESCALE
Quantity:
20 000
A.10
This section provides details about program/erase times and program-erase endurance for the FLASH
memory.
Program and erase operations do not require any special power sources other than the normal V
For more detailed information about program/erase operations, see
Freescale Semiconductor
1
2
3
4
Supply voltage for program/erase
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Program/erase endurance
Data retention
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information
supplied for calculating approximate time to program and erase.
Typical endurance for FLASH was evaluated for this product family on the 9S12Dx64. For additional
information on how Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin
EB619/D, Typical Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature
and de-rated to 25°C using the Arrhenius equation. For additional information on how Freescale Semiconductor
defines typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for
Nonvolatile Memory.
0 < f
0 < f
T
T = 25°C
L
FLASH Specifications
to T
Bus
Bus
H
< 8 MHz
< 20 MHz
= –40°C to + 85°C
Characteristic
4
2
(2)
1
3
(2)
Table A-13. FLASH Characteristics
MC9S08GB/GT Data Sheet, Rev. 2.3
(2)
V
Symbol
prog/erase
V
f
t
t
t
t
t
t
FCLK
Burst
Mass
D_ret
Page
Fcyc
prog
Read
10,000
2.08
Min
150
2.1
1.8
15
5
Chapter 4,
100,000
Typical
20,000
4000
100
9
4
“Memory.”
Max
6.67
200
3.6
3.6
3.6
FLASH Specifications
cycles
years
Unit
t
t
t
t
kHz
Fcyc
Fcyc
Fcyc
Fcyc
µs
V
V
DD
supply.
279

Related parts for MC9S08GT60CFD