MC9S12XEQ384CAL Freescale Semiconductor, MC9S12XEQ384CAL Datasheet - Page 1211
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MC9S12XEQ384CAL
Manufacturer Part Number
MC9S12XEQ384CAL
Description
MCU 16BIT 384K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XEP768CAL.pdf
(1328 pages)
Specifications of MC9S12XEQ384CAL
Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
24 KB
Interface Type
CAN, SCI, SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XEQ384CAL
Manufacturer:
FREESCAL
Quantity:
256
Company:
Part Number:
MC9S12XEQ384CAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XEQ384CAL
Manufacturer:
NXP/恩智浦
Quantity:
20 000
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Freescale Semiconductor
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Num
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12b
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The values for thermal resistance are achieved by package simulations for the 9S12XEQ512 die.
Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique
with the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described
by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the
package is being used with a heat sink.
Thermal characterization parameter Ψ
case as defined in JESD51-2. Ψ
enviroment.
3
4
5
8
9
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board LQFP 144
Junction to Case LQFP 144
Junction to Package Top LQFP144
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
Table A-6. Thermal Package Characteristics (9S12XEQ512)
JT
is a useful value to use to estimate junction temperature in a steady state customer
MC9S12XE-Family Reference Manual Rev. 1.23
2
Rating
2
JT
2
is the “resistance” from junction to reference point thermocouple on top center of the
3
3
3
LQFP144
LQFP112
QFP80
Symbol
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JA
JA
JA
JA
JB
JA
JA
JA
JA
JB
JA
JA
JA
JA
JB
JT
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Appendix A Electrical Characteristics
1
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max
49
40
40
34
28
50
40
40
34
28
50
40
37
31
23
13
9
2
9
2
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
1211
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