MCF5208CAB166 Freescale Semiconductor, MCF5208CAB166 Datasheet - Page 5

• Manufacturer Part Number: MCF5208CAB166
• Description: MCU 32BIT 166.67MHZ 160-QFP
• Manufacturer: Freescale Semiconductor
• Series: MCF520xr

Specifications of MCF5208CAB166

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166.67MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 50
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 160-QFP
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 166.67MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.6/1.95/2.75/3.6V
• Operating Supply Voltage (min): 1.4/1.7/2.25/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 160
• Package Type: PQFP
• Processor Series: MCF520x
• Core: ColdFire V2
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

Note: The MCF5207 does not contain an FEC module. However, the UART0 and UART1 control signals (as well as their GPIO signals)
are available by setting the appropriate FEC GPIO port registers.
FEC_RXD[3:2]
FEC_TXD[3:1]
Signal Name
FEC_TXCLK
FEC_RXCLK
FEC_RXDV
FEC_RXER
FEC_MDIO
FEC_TXEN
FEC_TXD0
FEC_RXD0
FEC_TXER
FEC_RXD1
FEC_MDC
FEC_COL
FEC_CRS
I2C_SDA
I2C_SCL
Freescale Semiconductor
IRQ7
IRQ4
IRQ1
—
—
—
—
2
2
2
2
2
DACK0 and DREQ0 do not have a dedicated bond pads. Please refer to the following pins for muxing:
PFECI2C0
PFECI2C1
PFECL[7:5]
PFECL[3:2]
PFECI2C3
PFECI2C2
PFECH7
PFECH6
PFECH6
PFECH5
PFECH4
PFECH3
PFECH2
PFECH1
PFECH0
PFECL4
PFECL4
PFECL1
PFECL1
PFECL0
PFECL0
PIRQ7
PIRQ4
PIRQ1
GPIO
2
2
2
Table 3. MCF5207/8 Signal Information and Muxing (continued)
2
2
TS and QSPI_CS2 for DACK0, IRQ4 and QSPI_DIN for DREQ0.
Alternate 1
I2C_SCL
I2C_SDA
DREQ0
U2RXD
U2TXD
MCF5208 ColdFire
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
2
2
2
2
Alternate 2
U2RXD
U2TXD
U1RTS
U1RTS
U0RTS
U0RTS
U1CTS
U1CTS
U0CTS
U0CTS
External Interrupts Port
—
—
—
—
—
—
—
—
—
—
—
—
—
—
®
Microprocessor Data Sheet, Rev. 3
DMA
FEC
I/O
I/O
I/O
O
O
O
O
O
O
O
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
2
C
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
5
MCF5207
LQFP
144
134
133
132
142
141
139
140
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
MCF5207
MAPBGA
144
A5
C6
B6
A2
D5
B4
E4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
MCF5208
149–150
Signal Descriptions
QFP
160
142
141
140
148
147
157
158
154
153
152
6–4
156
151
155
—
—
—
—
—
—
3
7
8
C1, C2, B2
MAPBGA
MCF5208
A5, B5
196
C7
D7
D8
D6
C6
D3
D5
D2
C5
C4
D1
B3
A2
B1
B4
A4
A3
E4
—
—
—
—
5