HD64F3687GH Renesas Electronics America, HD64F3687GH Datasheet - Page 105
HD64F3687GH
Manufacturer Part Number
HD64F3687GH
Description
IC H8 MCU FLASH 56K 64-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet
1.HD64F3684GFPV.pdf
(538 pages)
Specifications of HD64F3687GH
Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Table 5.1
5.1.2
Figure 5.5 shows a typical method of connecting a ceramic resonator.
5.1.3
Connect an external clock signal to pin OSC
connection. The duty cycle of the external clock signal must be 45 to 55%.
Frequency (MHz)
R
C
S
0
(max)
(max)
Connecting Ceramic Resonator
External Clock Input Method
Crystal Resonator Parameters
Figure 5.5 Typical Connection to Ceramic Resonator
2
500
7 pF
Figure 5.6 Example of External Clock Input
OSC
OSC
OSC
OSC
1
2
1
4
120
7 pF
2
1
Open
, and leave pin OSC
8
80
7 pF
C
C
1
2
External clock input
10
60
7 pF
C
C
Rev.5.00 Nov. 02, 2005 Page 71 of 500
1
2
= 5 to 30 pF
= 5 to 30 pF
2
open. Figure 5.6 shows a typical
Section 5 Clock Pulse Generators
16
50
7 pF
REJ09B0027-0500
20
40
7 pF
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