MCF5212CAE66 Freescale Semiconductor, MCF5212CAE66 Datasheet - Page 31

IC MCU 256K FLASH 66MHZ 64-LQFP

MCF5212CAE66

Manufacturer Part Number
MCF5212CAE66
Description
IC MCU 256K FLASH 66MHZ 64-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF521xr
Datasheet

Specifications of MCF5212CAE66

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
55
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
MCF521x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
I2C, QSPI, UART
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
56
Number Of Timers
10
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M52210DEMO, M52211EVB
Minimum Operating Temperature
0 C
On-chip Adc
12 bit, 8 Channel
For Use With
M5211DEMO - KIT DEMO FOR MCF5211
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Price
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2.5
2.6
Freescale Semiconductor
Name
EP1a
EP1
EP2
EP3
EP4
EP5
EP6
EP7
EP8
EP9
EzPort Electrical Specifications
ESD Protection
EPCK frequency of operation (all commands except READ)
EPCK frequency of operation (READ command)
EPCS_b negation to next EPCS_b assertion
EPCS_B input valid to EPCK high (setup)
EPCK high to EPCS_B input invalid (hold)
EPD input valid to EPCK high (setup)
EPCK high to EPD input invalid (hold)
EPCK low to EPQ output valid (out setup)
EPCK low to EPQ output invalid (out hold)
EPCS_B negation to EPQ tri-state
1
2
Characteristics
ESD target for Human Body Model
ESD target for Machine Model
HBM circuit description
MM circuit description
Number of pulses per pin (HBM)
Number of pulses per pin (MM)
Interval of pulses
• Positive pulses
• Negative pulses
• Positive pulses
• Negative pulses
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
A device is defined as a failure if after exposure to ESD pulses the device no longer
meets the device specification requirements. Complete DC parametric and functional
testing is performed per applicable device specification at room temperature followed by
hot temperature, unless specified otherwise in the device specification.
Table 27. ESD Protection Characteristics
Table 26. EzPort Electrical Specifications
MCF5213 ColdFire Microcontroller, Rev. 4
Characteristic
Symbol
R
R
HBM
MM
series
series
C
C
Value
2000
1500
200
100
200
0
1
1
3
3
1
1, 2
2 × T
Min
5
5
2
5
0
Units
cyc
sec
pF
pF
V
V
Ω
Ω
Electrical Characteristics
f
f
sys
sys
Max
12
12
/ 2
/ 8
Unit
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
31

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