DSP56F805FV80E Freescale Semiconductor, DSP56F805FV80E Datasheet - Page 22

IC DSP 80MHZ 31.5K FLASH 144LQFP

DSP56F805FV80E

Manufacturer Part Number
DSP56F805FV80E
Description
IC DSP 80MHZ 31.5K FLASH 144LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxr
Datasheet

Specifications of DSP56F805FV80E

Core Processor
56800
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
71KB (35.5K x 16)
Program Memory Type
FLASH
Ram Size
2.5K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Product
DSPs
Data Bus Width
16 bit
Processor Series
DSP56F8xx
Core
56800
Numeric And Arithmetic Format
Fixed-Point
Instruction Set Architecture
MAC
Device Million Instructions Per Second
40 MIPs
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
32
Data Ram Size
4 KB
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
PBMCUSLK, DSP56F800DEMO-E
Interface Type
SCI, SPI
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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3.2 DC Electrical Characteristics
22
Input high voltage (XTAL/EXTAL)
Input low voltage (XTAL/EXTAL)
Input high voltage (Schmitt trigger inputs)
Input low voltage (Schmitt trigger inputs)
Input high voltage (all other digital inputs)
Input low voltage (all other digital inputs)
Input current high (pullup/pulldown resistors disabled, V
Input current low (pullup/pulldown resistors disabled, V
Input current high (with pullup resistor, V
Input current low (with pullup resistor, V
Input current high (with pulldown resistor, V
Input current low (with pulldown resistor, V
Nominal pullup or pulldown resistor value
Output tri-state current low
Output tri-state current high
Input current high (analog inputs, V
Input current low (analog inputs, V
Output High Voltage (at IOH)
4.
5.
6.
7.
Operating Conditions:
Thermal Characterization Parameter, Psi-JT (Ψ
thermocouple on top center of case as defined in JESD51-2. Ψ
temperature in steady-state customer environments.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
See Section 5.1 from more details on thermal design considerations.
TJ = Junction Temperature
TA = Ambient Temperature
Characteristic
V
Table 3-4 DC Electrical Characteristics
SS
IN
IN
=V
= V
=V
SSA
IN
SSA
DDA
1
IN
1
=V
=V
IN
)
3
= 0 V, V
IN
)
56F805 Technical Data, Rev. 16
SS
=V
2
DD
=V
)
SS
)
DD
)
)
DD
JT
= V
IN
IN
), is the “resistance” from junction to reference point
=V
=V
DDA
SS
DD
)
= 3.0–3.6 V, T
)
JT
is a useful value to use to estimate junction
R
Symbol
PU
I
I
I
I
V
V
I
V
V
I
V
IHPU
IHPD
I
V
ILPU
ILPD
OZH
I
V
OZL
A
I
IHA
I
ILA
IHC
IHS
ILC
ILS
IH
, R
OH
IL
IH
IL
= –40° to +85°C, C
PD
V
DD
2.25
-210
Min
-0.3
-0.3
-10
-10
-15
-15
2.2
2.0
20
-1
-1
-1
-1
0
– 0.7
L
Freescale Semiconductor
Typ
50pF, f
30
op
Max
2.75
180
0.5
5.5
0.8
5.5
0.8
-50
10
10
15
15
= 80MHz
1
1
1
1
Unit
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
V
V
V
V
V
V
V

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