COP8CCE9IMT7/NOPB National Semiconductor, COP8CCE9IMT7/NOPB Datasheet - Page 25

• Manufacturer Part Number: COP8CCE9IMT7/NOPB
• Description: MCU 8BIT FLASH 8K MEM 48-TSSOP
• Manufacturer: National Semiconductor
• Series: COP8™ 8Cr

Specifications of COP8CCE9IMT7/NOPB

• Core Processor: COP8
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: Microwire/Plus (SPI), UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 48-TSSOP
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 10 MHz
• Data Ram Size: 256 B
• On-chip Adc: 10 bit, 16 channel
• Number Of Programmable I/os: 37
• Number Of Timers: 2
• Height: 0.9 mm
• Interface Type: SPI, USART
• Length: 12.5 mm
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Width: 6.1 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: COP8CCE9IMT7

10.0 Functional Description
10.8 OSCILLATOR CIRCUITS
The device has two crystal oscillators to facilitate low power
operation while maintaining throughput when required. Fur-
ther information on the use of the two oscillators is found in
The crystal and other oscillator components should be
placed in close proximity to the CKI and CKO pins to mini-
mize printed circuit trace length.
The values for the external capacitors should be chosen to
obtain the manufacturer’s specified load capacitance for the
crystal when combined with the parasitic capacitance of the
trace, socket, and package (which can vary from 0 to 8 pF).
The guideline in choosing these capacitors is:
Manufacturer’s specified load cap = (C
C
*Applies to connection to low speed oscillator on port pins L0 and L1 only.
**See Note below.
(Continued)
parasitic
R1 (kΩ)
FIGURE 11. Reset Circuit Using Power-On Reset
5.6
0
0
0
0
TABLE 2. Crystal Oscillator Configuration,
R2 (MΩ)
On Chip
On Chip
On Chip
On Chip
20
High Speed Oscillator
T
A
= 25˚C, V
C1 (pF)
18–36
100
18
18
**
CC
20022515
= 5V
100–156
C2 (pF)
18–36
1
18
18
**
* C
20022514
2
) / (C
FIGURE 12. Crystal Oscillator
CKI Freq.
32.768
(MHz)
1
0.455
kHz*
10
+ C
5
1
2
) +
25
Section 7.0 Power Saving Features. The low speed oscillator
utilizes the L0 and L1 port pins. References in the following
text to CKI will also apply to L0 and references to G7/CKO
will also apply to L1.
10.8.1 Oscillator
CKI is the clock input while G7/CKO is the clock generator
output to the crystal. An on-chip bias resistor connected
between CKI and CKO is provided to reduce system part
count. The value of the resistor is in the range of 0.5M to 2M
(typically 1.0M). Table 2 shows the component values re-
quired for various standard crystal values. Resistor R2 is
on-chip, for the high speed oscillator, and is shown for
reference. Figure 12 shows the crystal oscillator connection
diagram. A ceramic resonator of the required frequency may
be used in place of a crystal if the accuracy requirements are
not quite as strict.
C
should be less than or equal to C
Note: The low power design of the low speed oscillator
makes it extremely sensitive to board layout and load ca-
pacitance. The user should place the crystal and load ca-
pacitors within 1cm. of the device and must ensure that the
above equation for load capacitance is strictly followed. If
these conditions are not met, the application may have
problems with startup of the low speed oscillator.
2
32 kHz (low speed oscillator)
can be trimmed to obtain the desired frequency. C
CKI Frequency
3.33 MHz
455 kHz
10 MHz
1 MHz
TABLE 3. Startup Times
Low Speed Oscillator
20022516
1
.
Startup Time
10–30 ms
1–10 ms
3–10 ms
3–20 ms
2–5 sec
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2