HD6473258P10V Renesas Electronics America, HD6473258P10V Datasheet - Page 220

• Manufacturer Part Number: HD6473258P10V
• Description: MCU 5V 32K PB-FREE 64-DIP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/325r

Specifications of HD6473258P10V

• Core Size: 8-Bit
• Program Memory Size: 32KB (32K x 8)
• Oscillator Type: External
• Core Processor: H8/300
• Speed: 10MHz
• Connectivity: SCI, UART/USART
• Number Of I /o: 53
• Program Memory Type: OTP
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-DIP
• No. Of I/o's: 53
• Ram Memory Size: 1024Byte
• Cpu Speed: 10MHz
• No. Of Timers: 3
• Digital Ic Case Style: DIP
• Supply Voltage: RoHS Compliant
• Controller Family/series: H8/330
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Peripherals: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.3.3 Notes on Writing
(1) Write with the specified voltages and timing. The programming voltage (V
Caution: Applied voltages in excess of the specified values can permanently destroy the chip. Be
particularly careful about the PROM writer’s overshoot characteristics.
If the PROM writer is set to Intel specifications or Hitachi HN27C101, HN27256 or HN27C256
specifications, V
(2) Before writing data, check that the socket adapter and chip are correctly mounted in the
PROM writer. Overcurrent damage to the chip can result if the index marks on the PROM writer,
socket adapter, and chip are not correctly aligned.
(3) Don’t touch the socket adapter or chip while writing. Touching either of these can cause
contact faults and write errors.
(4) Page programming is not supported. Do not select page programming mode.
11.3.4 Reliability of Written Data
An effective way to assure the data holding characteristics of the programmed chips is to bake them
at 150˚C, then screen them for data errors. This procedure quickly eliminates chips with PROM
memory cells prone to early failure.
Figure 11-12 shows the recommended screening procedure.
Note:
PP
Baking time should be measured from the point when the baking oven reaches 150°C.
will be 12.5 V.
Figure 11-12. Recommended Screening Procedure
Bake with power off
150° ± 10°C, 48 Hr
Read and check program
Vcc = 4.5 V and 5.5 V
Write program
Install
215
+ 8 Hr *
– 0 Hr
Fig. 11-6
PP
) is 12.5 V.