UPD78F9212CS-CAB-A Renesas Electronics America, UPD78F9212CS-CAB-A Datasheet - Page 354

• Manufacturer Part Number: UPD78F9212CS-CAB-A
• Description: MCU 8BIT 4KB FLASH 16PIN
• Manufacturer: Renesas Electronics America
• Series: 78K0S/Kx1+r

Specifications of UPD78F9212CS-CAB-A

• Core Processor: 78K0S
• Core Size: 8-Bit
• Speed: 10MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -

352
Electrical
specifica-
tions
(Standard
product,
(A) grade
product)
Electrical
specifica-
tions ((A2)
grade
product)
Recom-
mended
soldering
conditions
Function
A/D converter
(
only)
Absolute
maximum
ratings
X1 oscillator
characteristics
A/D converter
(
only)
μ
μ
PD78F921x
PD78F921x
Details of
Function
−
The conversion accuracy may be degraded when the analog input pin is used as
an alternate I/O port or if the level of a port that is not used for A/D conversion is
changed during A/D conversion.
Product quality may suffer if the absolute maximum rating is exceeded even
momentarily for any parameter. That is, the absolute maximum ratings are rated
values at which the product is on the verge of suffering physical damage, and
therefore the product must be used under conditions that ensure that the absolute
maximum ratings are not exceeded.
When using the X1 oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
The conversion accuracy may be degraded when the analog input pin is used as
an alternate I/O port or if the level of a port that is not used for A/D conversion is
changed during A/D conversion.
For soldering methods and conditions other than those recommended below,
contact an NEC Electronics sales representative.
Do not use different soldering methods together (except for partial heating).
Only the pins of the THD are heated when performing wave soldering.
Make sure that flow solder does not come in contact with the package.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating
• Always make the ground point of the oscillator capacitor the same potential as
• Do not ground the capacitor to a ground pattern through which a high current
• Do not fetch signals from the oscillator.
current flows.
V
flows.
SS
.
APPENDIX D LIST OF CAUTIONS
User’s Manual U16994EJ6V0UD
Cautions
p. 301
p. 305
p. 307
p. 314
p. 323
pp. 323,
324
p. 324
Page
(15/15)