SAK-XE167FM-72F80L AA Infineon Technologies, SAK-XE167FM-72F80L AA Datasheet - Page 139
![no-image](/images/manufacturer_photos/0/3/327/infineon_technologies_sml.jpg)
SAK-XE167FM-72F80L AA
Manufacturer Part Number
SAK-XE167FM-72F80L AA
Description
IC MCU 16BIT FLASH 144-LQFP
Manufacturer
Infineon Technologies
Series
XE16xr
Datasheet
1.SAF-XE167KM-48F80L_AA.pdf
(140 pages)
Specifications of SAK-XE167FM-72F80L AA
Core Processor
C166SV2
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
576KB (576K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-LFQFP
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, UART, SPI, I2S
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
119
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 24 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
SP000628636
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5.2
When operating the XE167xM in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(switching current and leakage current).
OH
+
) ×
P
IODYN
I
OH
) + Σ(
) ×
R
ΘJA
V
OL
XE167FM, XE167GM, XE167HM, XE167KM
×
I
OL
139
)
XE166 Family Derivatives / Base Line
R
ΘJA
” quantifies these parameters. The
Package and Reliability
P
IODYN
V2.0, 2009-03
) depends
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