CY7C60223-PXC Cypress Semiconductor Corp, CY7C60223-PXC Datasheet - Page 63

• Manufacturer Part Number: CY7C60223-PXC
• Description: IC MCU 8K WIRELESS 24-DIP
• Manufacturer: Cypress Semiconductor Corp
• Series: enCoRe™ II CY7C602xxr

Specifications of CY7C60223-PXC

• Core Processor: M8C
• Core Size: 8-Bit
• Speed: 12MHz
• Connectivity: SPI
• Peripherals: LVD, POR, WDT
• Number Of I /o: 20
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 24-DIP (0.300", 7.62mm)
• For Use With: 770-1001 - ISP 4PORT CYPRESS ENCORE II MCUCY3216 - KIT PROGRAMMER MODULAR428-1774 - EXTENSION KIT FOR ENCORE II428-1773 - KIT DEVELOPMENT ENCORE II
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Other names: 428-1797

21. Ordering Information
22. Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may
degrade device reliability.
Document 38-16016 Rev. *F
1
CY7C60123-PVXC
CY7C60123-PXC
CY7C60113-PVXC
CY7C60223-PXC
CY7C60223-SXC
CY7C60223-QXC
T
T
BAKETEMP
BAKETIME
SCK (CPOL=0)
SCK (CPOL=1)
SS
MOSI
MISO
Parameter
Ordering Code
T
SDO1
Bake Temperature
Bake Time
T
SSS
T
MSB
SSU
Description
T
SHD
T
MSB
SCKH
Figure 20-6. SPI Slave Timing, CPHA = 0
Flash Size
T
SDO
T
See package label
8K
8K
8K
8K
8K
8K
SCKL
Min
RAM Size
256
256
256
256
256
256
40-PDIP
24-PDIP
24-QSOP
48-SSOP
28-SSOP
24-SOIC
Typical
125
CY7C601xx, CY7C602xx
LSB
Package Type
LSB
See package label
Max
72
T
SSH
Page 63 of 68
hours
Unit
°C
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