MC9S08RE16FDE Freescale Semiconductor, MC9S08RE16FDE Datasheet - Page 187
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MC9S08RE16FDE
Manufacturer Part Number
MC9S08RE16FDE
Description
IC MCU 16K FLASH 1K RAM 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08RE16FDE
Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
48-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
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Development Support
Figure 15-3
shows the host receiving a logic 1 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the perceived start of the bit time in the target MCU. The host holds the BKGD pin low long
enough for the target to recognize it (at least two target BDC cycles). The host must release the low drive
before the target MCU drives a brief active-high speedup pulse seven cycles after the perceived start of the
bit time. The host should sample the bit level about 10 cycles after it started the bit time.
BDC CLOCK
(TARGET MCU)
HOST DRIVE
HIGH-IMPEDANCE
TO BKGD PIN
TARGET MCU
SPEEDUP PULSE
HIGH-IMPEDANCE
HIGH-IMPEDANCE
PERCEIVED START
OF BIT TIME
R-C RISE
BKGD PIN
10 CYCLES
EARLIEST START
OF NEXT BIT
10 CYCLES
HOST SAMPLES BKGD PIN
Figure 15-3. BDC Target-to-Host Serial Bit Timing (Logic 1)
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
Freescale Semiconductor
187
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