MC9S08RE16FDE Freescale Semiconductor, MC9S08RE16FDE Datasheet - Page 215
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MC9S08RE16FDE
Manufacturer Part Number
MC9S08RE16FDE
Description
IC MCU 16K FLASH 1K RAM 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08RE16FDE
Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
48-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
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Freescale Semiconductor
1. Refer to
2. All timing is shown with respect to 20% V
3. Maximum baud rate must be limited to 5 MHz due to pad input characteristics.
4. Time to data active from high-impedance state.
5. Hold time to high-impedance state.
Number
SPI pins. All timing assumes slew rate control disabled and high drive strength enabled for SPI
output pins.
10
11
1
2
3
4
5
6
7
8
9
(1)
Figure A-11
Operating frequency
Cycle time
Enable lead time
Enable lag time
Clock (SPSCK) high time
Master and Slave
Clock (SPSCK) low time
Master and Slave
Data setup time (inputs)
Data hold time (inputs)
Access time, slave
Disable time, slave
Data setup time (outputs)
Data hold time (outputs)
Characteristic
through
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
Table A-11. SPI Electrical Characteristic
(4)
Figure
(5)
(3)
(2)
Master
Master
Master
Master
Master
Master
Master
Master
A-14.
Slave
Slave
Slave
Slave
Slave
Slave
Slave
Slave
DD
and 70% V
Symbol
t
t
t
t
t
t
t
t
SCKH
t
t
SCKL
HI(M)
t
t
SI(M)
HI(S)
Lead
Lead
SI(S)
t
t
t
t
SCK
SCK
t
f
f
Lag
Lag
SO
SO
HO
HO
t
op
op
dis
A
DD
1/2 t
1/2 t
f
Bus
, unless noted; 100 pF load on all
SCK
SCK
Min
–10
–10
1/2
1/2
dc
30
30
30
30
25
25
/2048
—
—
—
2
4
0
– 25
– 25
f
f
Bus
Bus
2048
Max
1/2
1/2
—
—
—
40
40
—
—
—
—
—
—
—
—
—
—
/2
/4
Electrical Characteristics
t
t
t
t
Unit
t
t
SCK
SCK
SCK
SCK
Hz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
cyc
cyc
215
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