SAF-XC164LM-4F40F AA Infineon Technologies, SAF-XC164LM-4F40F AA Datasheet - Page 49
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SAF-XC164LM-4F40F AA
Manufacturer Part Number
SAF-XC164LM-4F40F AA
Description
IC MCU 16BIT 32KB FLASH TQFP64-8
Manufacturer
Infineon Technologies
Series
XC16xr
Datasheet
1.SAF-XC164LM-16F40F_BA.pdf
(61 pages)
Specifications of SAF-XC164LM-4F40F AA
Core Processor
C166SV2
Core Size
16-Bit
Speed
40MHz
Connectivity
SPI, UART/USART
Peripherals
PWM, WDT
Number Of I /o
47
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.7 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LFQFP
Packages
PG-LQFP-64
Max Clock Frequency
40.0 MHz
Sram (incl. Cache)
4.0 KByte
Program Memory
32.0 KByte
For Use With
MCBX167-NET - BOARD EVAL INFINEON CAN/ETHRNTMCBXC167-BASIC - BOARD EVAL BASIC INFINEON XC16X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Other names
SAF-XC164LM-4F40FAACT
SAF-XC164LM-4F40FAACT
SAF-XC164LM-4F40FAAINCT
SAF-XC164LM-4F40FAACT
SAF-XC164LM-4F40FAAINCT
Table 13
Parameter
Power supply current (active)
with all peripherals active
Pad supply current
Idle mode supply current with
all peripherals active
Sleep and Power down mode
supply current caused by
leakage
Sleep and Power down mode
supply current caused by
leakage and the RTC running,
clocked by the main oscillator
1) During Flash programming or erase operations the supply current is increased by max. 5 mA.
2) The supply current is a function of the operating frequency. This dependency is illustrated in
3) The pad supply voltage pins (
4) The total supply current in Sleep and Power down mode is the sum of the temperature dependent leakage
5) This parameter is determined mainly by the transistor leakage currents. This current heavily depends on the
6) All inputs (including pins configured as inputs) at 0 V to 0.1 V or at
7) This parameter is determined mainly by the current consumed by the oscillator switched to low gain mode (see
Data Sheet
These parameters are tested at
all inputs at
amount of current is consumed even though no outputs are driven, because the drivers’ input stages are
switched and also the Flash module draws some power from the
current and the frequency dependent current for RTC and main oscillator.
junction temperature (see
if no current flows through the port output drivers. Otherwise, the resulting temperature difference must be
taken into account.
pins configured as outputs) disconnected. This parameter is tested at 25 °C and is valid for
Figure
given values refer to a typical circuitry and may change in case of a not optimized external oscillator circuitry.
4)
10). This current, however, is influenced by the external oscillator circuitry (crystal, capacitors). The
V
IL
Power Consumption XC164LM (Operating Conditions apply)
or
V
IH
.
Figure
V
DDP
V
DDImax
11). The junction temperature
4)
) mainly provides the current consumed by the pin output drivers. A small
Sym-
bol
I
I
I
I
I
DDI
DDP
IDX
PDL
PDM
and maximum CPU clock frequency with all outputs disconnected and
5)
7)
Min.
–
–
–
–
–
–
–
–
Limit Values
47
Max.
15 +
2.6 ×
10 +
2.6 ×
5
15 +
1.2 ×
10 +
1.2 ×
84,000
× e
128,000
× e
0.6 +
0.02 ×
+
I
PDL
-α
-α
T
f
f
f
f
J
V
CPU
CPU
CPU
CPU
f
is the same as the ambient temperature
OSC
V
DDP
DDP
supply.
- 0.1 V to
Unit Test Condition
mA
mA
mA
mA
mA
mA
mA
mA
Electrical Parameters
f
-16F derivatives
f
-4F/8F derivatives
3)
f
-16F derivatives
f
-4F/8F derivatives
V
T
α = 4380 / (273 +
-16F derivatives
α = 4670 / (273 +
-4F/8F derivatives
V
f
V
CPU
CPU
CPU
CPU
OSC
J
DDP
DDI
DDI
in [°C]
, all outputs (including
in [MHz]
in [MHz]
in [MHz]
in [MHz]
in [MHz]
=
=
V
V
Derivatives
T
DDImax
DDImax
V1.2, 2007-03
Figure
J
XC164LM
≥ 25 °C.
1)2)
2)
2)
1)2)
6)
,
,
9.
,
,
T
T
J
J
T
)
)
A