OP497GPZ Analog Devices Inc, OP497GPZ Datasheet - Page 4

• Manufacturer Part Number: OP497GPZ
• Description: IC OPAMP GP 500KHZ QUAD 14DIP
• Manufacturer: Analog Devices Inc

Specifications of OP497GPZ

• Slew Rate: 0.15 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Gain Bandwidth Product: 500kHz
• Current - Input Bias: 60pA
• Voltage - Input Offset: 80µV
• Current - Supply: 525µA
• Current - Output / Channel: 25mA
• Voltage - Supply, Single/dual (±): ±2 V ~ 20 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Op Amp Type: Precision
• No. Of Amplifiers: 4
• Bandwidth: 500kHz
• Supply Voltage Range: ± 2V To ± 20V
• Amplifier Case Style: DIP
• No. Of Pins: 14
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

OP497
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply to packaged parts.
Table 2.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For supply voltages less than ±20 V, the absolute maximum input voltage is
equal to the supply voltage.
1
1
Rating
±20 V
20 V
40 V
Indefinite
−65°C to +150°C
−40°C to +85°C
−65°C to +150°C
300°C
Rev. E | Page 4 of 16
THERMAL RESISTANCE
θ
θ
θ
(PCB) for the SOIC package.
Table 3.
Package Type
14-Lead PDIP (N-14)
16-Lead SOIC (RW-16)
ESD CAUTION
CHANNEL SEPARATION = 20 log
JA
JA
JA
is specified for the worst-case mounting conditions, that is,
is specified for a device in socket for the PDIP package, and
is specified for a device soldered to the printed circuit board
–
OP497
+
1/4
Figure 4. Channel Separation Test Circuit
(
2kΩ
V
2
/10,000
V
V
1
1
50Ω
20V p-p @ 10Hz
θ
76
92
JA
)
–
OP497
+
50kΩ
1/4
θ
33
23
JC
Unit
°C/W
°C/W
V
2