AMMP-6130-TR1G Avago Technologies US Inc., AMMP-6130-TR1G Datasheet - Page 7

• Manufacturer Part Number: AMMP-6130-TR1G
• Description: IC MMIC PWR AMP 30GHZ 8SMD
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of AMMP-6130-TR1G

• Gain: 18.5dB
• Current - Supply: 200mA
• Frequency: 15GHz, 30GHz
• Package / Case: 8-SMD
• Rf Type: VSAT, DBS
• Voltage - Supply: 3.5 V ~ 5 V
• Supply Current: 200mA
• Supply Voltage Range: 3.5V To 5V
• Rf Ic Case Style: SMD
• No. Of Pins: 8
• Frequency Max: 30GHz
• Termination Type: SMD
• Frequency Min: 1GHz
• Supply Voltage Max: 5V
• Number Of Channels: 1
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3.5V
• Single Supply Voltage (typ): 4.5V
• Single Supply Voltage (max): 5V
• Package Type: SMT
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Pin Count: 8
• Mounting: Surface Mount
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

Manual Assembly
• Follow ESD precautions while handling packages.
• Handling should be along the edges with tweezers.
• Recommended attachment is conductive solder
• Apply solder paste using a stencil printer or dot place-
• Follow solder paste and vendor’s recommendations
• Packages have been qualified to withstand a peak
Figure 11. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
Package Dimensions
A
paste. Please see recommended solder reflow profile.
Neither Conductive epoxy or hand soldering is recom-
mended.
ment. The volume of solder paste will be dependent
on PCB and component layout and should be con-
trolled to ensure consistent mechanical and electrical
performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tem-
perature to the pre-heat temp. to avoid damage due
to thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
300
250
200
150
100
NOTES:
1.
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
SYMBOL
A
B
DIMENSIONS ARE IN INCHES (MM)
50
8
*
0
INDICATES PIN 1
0
Ramp 1
AMMP
XXXX
YWWDNN
FRONT VIEW
50
1
7
0.0685 (1.74)
0.198 (5.03)
Preheat Ramp 2 Reflow
MIN.
A
2
6
3
5
Peak = 250 ± 5˚C
100
Seconds
0.088 (2.25)
0.213 (5.4)
150
MAX.
4
Melting point = 218˚C
200
SIDE VIEW
B
Cooling
250
300
0.126
(3.2)
0.029 (0.75)
DIMENSIONAL TOLERANCE FOR BACK VIEW: 0.002" (0.05 mm)
0.059
(1.5)
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 8. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste
smear or bridging across the I/O pads. Considering the
fact that solder paste thickness will directly affect the
quality of the solder joint, a good choice is to use a laser
cut stencil composed of 0.127mm (5 mils) thick stainless
steel which is capable of producing the required fine
stencil outline.
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 9. This profile is de-
signed to ensure reliable finished joints. However, the
profile indicated in Figure 1 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
0.016 (0.40)
0.100 (2.54)
0.100 (2.54)
0.011 (0.28)
4
0.114 (2.90)
0.018 (0.46)
BACK VIEW
3
0.93 (2.36)
5
2
6
1
7
*
0.028 (0.70)
8
0.012 (0.30)
0.014 (0.365)
0.016 (0.40)