AMMP-6220-TR1 Avago Technologies US Inc., AMMP-6220-TR1 Datasheet - Page 9

• Manufacturer Part Number: AMMP-6220-TR1
• Description: IC MMIC LOW NOISE 6-20GHZ 8-SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMP-6220-TR1

• Rf Type: ISM, MMDS, WLL, 802.16/WiMAX, DBS, VSAT
• Gain: 22dB
• Current - Supply: 55mA ~ 70mA
• Frequency: 6GHz ~ 20GHz
• Noise Figure: 2.5dB
• P1db: 10dBm
• Package / Case: 8-QFN
• Voltage - Supply: 3V ~ 7V
• Frequency Rf: 20GHz
• Noise Figure Typ: 2.5dB
• Supply Current: 55mA
• Frequency Max: 20GHz
• Termination Type: SMD
• Frequency Min: 6GHz
• Supply Voltage Max: 3V
• Manufacturer's Type: Low Noise Amplifier
• Number Of Channels: 1
• Frequency (max): 20GHz
• Operating Supply Voltage (typ): 3V
• Package Type: SMT
• Mounting: Surface Mount
• Pin Count: 8
• Noise Figure (typ): 2.5dB
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

9
Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
4. Apply solder paste using a stencil printer or dot place-
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak
AMMP-6220 Part Number Ordering Information
Part Number
AMMP-6220-BLK
AMMP-6220-TR1
AMMP-6220-TR2
Please see recommended solder reflow profile. Con-
ductive epoxy is not recommended. Hand soldering
is not recommended.
ment. The volume of solder paste will be dependent on
PCB and component layout and should be controlled
to ensure consistent mechanical and electrical perfor-
mance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tempera-
ture to the pre-heat temperature to avoid damage due
to thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
Devices Per Container
10
100
500
Container
Antistatic bag
7” Reel
7” Reel
Solder Reflow Profile
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 26. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 26 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
Figure 26. Suggested lead-free reflow profile for SnAgCu solder paste.
300
250
200
150
100
50
0
0
RAMP 1
50
PREHEAT
100
RAMP 2
PEAK = 250 ± 5 C
TIME (SECONDS)
150
REFLOW
MELTING POINT = 218 C
200
COOLING
250
300