AMMP-5618-TR1 Avago Technologies US Inc., AMMP-5618-TR1 Datasheet - Page 7

• Manufacturer Part Number: AMMP-5618-TR1
• Description: IC AMP GP HI PWR 6-20GHZ 8-SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMP-5618-TR1

• Gain: 13dB
• Current - Supply: 107mA ~ 140mA
• Frequency: 6GHz ~ 20GHz
• Noise Figure: 4.4dB
• P1db: 19dBm
• Package / Case: 8-QFN
• Rf Type: ISM, MMDS, WLL, 802.16/WiMAX, DBS, VSAT
• Voltage - Supply: 5V
• Frequency Range: 6GHz To 20GHz
• Noise Figure Typ: 4.4dB
• Supply Current: 107mA
• Supply Voltage Range: 5V
• Rf Ic Case Style: SMD
• No. Of Pins: 8
• Frequency Max: 20GHz
• Termination Type: SMD
• Number Of Channels: 1
• Frequency (max): 20GHz
• Operating Supply Voltage (typ): 5V
• Package Type: SMD
• Mounting: Surface Mount
• Pin Count: 8
• Noise Figure (typ): 4.4dB
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

Figure 22. Outline Drawing.
Figure 23. Suggested PCB Material and Land Pattern.
7
0.126 [3.2]
.1260
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
Dimensional tolerance for back view: 0.002" [0.05 mm]
0.029 [0.75]
3.2
0.059 [1.5]
.0590
0.100 [2.54]
0.100 [2.54]
0.016 [0.40]
A
0.011 [0.28]
1.5
0.018 [0.46]
8
.0200
4
Symbol
AMMP
XXXX
YWWDNN
A
B
0.093 [2.36]
0.51
1
7
Front View
0.114 [2.9]
3 2 1
Back View
5
2 3
6 5
A
6 7
0.0685 (1.74)
0.198 (5.03)
.0180
.0110
Min
0.028 [0.70]
.0180
.0935
4
0.46
0.28
8
0.014 [0.365]
0.088 (2.25)
0.012 [0.30]
0.213 (5.4)
0.46
2.37
.0100
Max
0.016 [0.40]
Side View
B
0.25
Recommended SMT Attachment
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in the
data sheet, optimizes RF performance and is strongly rec-
ommended. An electronic drawing of the land pattern
is available upon request from Avago Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
4. Apply solder paste using a stencil printer or dot
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak
Please see recommended solder reflow profile. Con-
ductive epoxy is not recommended. Hand soldering
is not recommended.
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tempera-
ture to the pre-heat temperature to avoid damage due
to thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
.0095
0.114 [2.89]
.0160
0.24
0.41
.0160
.0095
.0120
0.41
0.24
0.3