DEMOBOARD-T7024PGM Atmel, DEMOBOARD-T7024PGM Datasheet - Page 4

BOARD DEMO FOR T7024PGM

DEMOBOARD-T7024PGM

Manufacturer Part Number
DEMOBOARD-T7024PGM
Description
BOARD DEMO FOR T7024PGM
Manufacturer
Atmel
Type
Bluetoothr

Specifications of DEMOBOARD-T7024PGM

Frequency
2.4GHz
Processor Series
T7024
Wireless Frequency
2.4 GHz
For Use With/related Products
T7024PGM
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
DEMOBOARD-T7024-PGM
Reference Design for
QFN20 Package
4
Design Guide T7024
The typical application module support circuitry of the T7024 in a QFN20 package is
shown in Figure 6 on page 5, Figure 7 on page 5 and Figure 8 on page 8.
The reference design consists of a four-layer FR4 printed circuit board where the upper
layer contains the RF lines and most DC connections. The internal layers are used for
ground connections. Some DC connections are made on the backside of the application
board. The RF lines for the LNA and PA input and output are 50
1 mm and a spacing of 0.5 mm to the ground layer. A Gerber file with information of the
printed circuit is available on request.
The application board consists of 4 layers:
Figure 5. T7024 Application Board Photo (QFN20 Package)
1. Top layer: RF-signals, 35 µm Cu. Spacing: 490 µm FRY
2. Second layer: GND, 35 µm Cu. Spacing: 550 µm FRY
3. Third layer: GND (optional), 35 µm Cu. Spacing: 490 µm FRY
4. Bottom layer: DC connections (optional), 35 µm Cu
lines with a width of
4549D–BLURF–06/04

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