MICRF211AYQS Micrel Inc, MICRF211AYQS Datasheet - Page 14

• Manufacturer Part Number: MICRF211AYQS
• Description: IC RX 3V 380-450 MHZ 16-QSOP
• Manufacturer: Micrel Inc

Specifications of MICRF211AYQS

• Operating Temperature: -40°C ~ 105°C
• Frequency: 380MHz ~ 450MHz
• Sensitivity: -110dBm
• Data Rate - Maximum: 10 kbps
• Modulation Or Protocol: ASK, OOK
• Applications: ISM, Garage Door Openers, RKE
• Current - Receiving: 6mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Features: No IF Filter Required
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 16-QSOP
• Data Rate: 1Kbps
• Frequency Range: 380MHz To 450MHz
• Modulation Type: ASK, OOK
• Sensitivity Dbm: -110dBm
• Rf Ic Case Style: QSOP
• No. Of Pins: 16
• Supply Voltage Range: 3V To 3.6V
• Operating Frequency (max): 450000kHz
• Operating Temperature (min): -40C
• Operating Temperature (max): 105C
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 576-1964-5; MICRF211AYQS

March 2007
Micrel
PCB Considerations and Layout
Figure 12 to 17 below show some of the printed circuit
layers for the QR211HE1 board. Use the Gerber files
provided (downloadable from Micrel Website) which
have the remaining layers needed to fabricate this
board. When copying or making your own boards,
make traces as short as possible. Long traces alter
the matching network and the values suggested are
no longer valid. Suggested Matching Values may vary
due to PCB variations. A PCB trace 100 mills (2.5mm)
long has about 1.1nH inductance. Optimization should
always be done with exhaustive range tests. Make
individual ground connections to the ground plane
with a Via for each ground connection. Do not share
Vias
with
ground
connections.
Figure 13. QR211HE1 Bottom Layer, Mirror Image.
Each
Figure 12. QR211HE1 Top Layer.
ground
14
connection = 1 via or more vias. Ground plane must
be solid and possibly without interruptions. Avoid
ground plane on top next to the matching elements. It
normally adds additional stray capacitance which
changes the matching. Do not use phenolic material,
only FR4 or better materials. Phenolic material is
conductive above 200MHz. RF path should be as
straight as possible avoiding loops and unnecessary
turns. Separate ground and V
circuits (microcontroller, etc). Known sources of noise
should be laid out as far as possible from the RF
circuits. Avoid thick traces, the higher the frequency,
the thinner the trace should be in order to minimize
losses in the RF path.
DD
lines from other
[phone]
M9999-030107
MICRF211