ATMEGA165P-16MUR Atmel, ATMEGA165P-16MUR Datasheet - Page 2
![IC MCU AVR 16K 16MHZ 64MLF](/photos/12/13/121326/313-64-qfn_sml.jpg)
ATMEGA165P-16MUR
Manufacturer Part Number
ATMEGA165P-16MUR
Description
IC MCU AVR 16K 16MHZ 64MLF
Manufacturer
Atmel
Series
AVR® ATmegar
Specifications of ATMEGA165P-16MUR
Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
SPI, UART/USART, USI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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1. Pin Configurations
Figure 1-1.
1.1
8019K–AVR–11/10
Disclaimer
(USCK/SCL/PCINT4) PE4
(XCK/AIN0/PCINT2) PE2
(DI/SDA/PCINT5) PE5
(OC0A/PCINT12) PB4
(OC1A/PCINT13) PB5
(OC1B/PCINT14) PB6
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(CLKO/PCINT7) PE7
(AIN1/PCINT3) PE3
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
(SCK/PCINT9) PB1
Pinout ATmega165P
(DO/PCINT6) PE6
(SS/PCINT8) PB0
DNC
Note:
Typical values contained in this datasheet are based on simulations and characterization of
other AVR microcontrollers manufactured on the same process technology. Min and Max values
will be available after the device is characterized.
10
11
12
14
15
16
13
1
2
5
6
7
8
9
3
4
The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
INDEX CORNER
ATmega165P
48
47
44
43
42
41
40
39
38
37
35
34
33
46
45
36
PA3
PA4
PA5
PA6
PA7
PG2
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PG1
PG0
2
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