LPC1224FBD48/201 NXP Semiconductors, LPC1224FBD48/201 Datasheet - Page 30

• Manufacturer Part Number: LPC1224FBD48/201
• Description: MCU 32BIT 32K FLASH 4K 48-LQFP
• Manufacturer: NXP Semiconductors

Specifications of LPC1224FBD48/201

• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 45MHz
• Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number Of I /o: 39
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-5153; LPC1224FBD48/201

NXP Semiconductors
9. Thermal characteristics
Table 6.
V
LPC122X
Objective data sheet
Symbol
R
R
T
DD
j(max)
th(j-a)
th(j-c)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to case
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
j
•
•
•
=

T
R
P
40
amb
T
D
th(j-a)
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)

P
D
All information provided in this document is subject to legal disclaimers.

Conditions
JEDEC test board; no
air flow
JEDEC test board

C unless otherwise specified.
R
LQFP64 package
LQFP48 package
LQFP64 package
LQFP48 package
th j a

Rev. 1.2 — 29 March 2011
–


j
(C), can be calculated using the following
Min
-
-
-
DD
32-bit ARM Cortex-M0 microcontroller
and V
DD
Typ
61
86
19
36
-
. The I/O power dissipation of
Max
-
-
-
-
150
LPC122x
© NXP B.V. 2011. All rights reserved.
Unit
C/W
C/W
C/W
C/W
C
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