PK40N512VMD100 Freescale Semiconductor, PK40N512VMD100 Datasheet - Page 30

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PK40N512VMD100

Manufacturer Part Number
PK40N512VMD100
Description
IC ARM CORTEX MCU 512K 144-MAP
Manufacturer
Freescale Semiconductor
Series
Kinetisr
Datasheets

Specifications of PK40N512VMD100

Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Data Converters
A/D 33x16b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LBGA
Rohs Compliant
Yes
Processor Series
Kinetis
Core
ARM Cortex M4
Data Ram Size
128 KB
Interface Type
UART, SPI, I2C, I2S, CAN
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
98
Operating Supply Voltage
1.71 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PK40N512VMD100
Manufacturer:
FSL
Quantity:
185
Part Number:
PK40N512VMD100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Peripheral operating requirements and behaviors
1. V
2. See crystal or resonator manufacturer's recommendation
3. C
4. When low power mode is selected, R
5. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any
6.3.2.2 Oscillator frequency specifications
1. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL
2. Proper PC board layout procedures must be followed to achieve specifications.
30
Symbol
Symbol
f
f
f
t
osc_hi_1
osc_hi_2
ec_extal
dc_extal
f
other devices.
V
osc_lo
t
DD
x
pp
cst
,C
5
=3.3 V, Temperature =25 °C
y
can be provided by using either the integrated capacitors or by using external components.
Peak-to-peak amplitude of oscillation (oscillator
mode) — low-frequency, low-power mode
(HGO=0)
Peak-to-peak amplitude of oscillation (oscillator
mode) — low-frequency, high-gain mode
(HGO=1)
Peak-to-peak amplitude of oscillation (oscillator
mode) — high-frequency, low-power mode
(HGO=0)
Peak-to-peak amplitude of oscillation (oscillator
mode) — high-frequency, high-gain mode
(HGO=1)
Oscillator crystal or resonator frequency — low
frequency mode (MCG_C2[RANGE]=00)
Oscillator crystal or resonator frequency — high
frequency mode (low range)
(MCG_C2[RANGE]=01)
Oscillator crystal or resonator frequency — high
frequency mode (high range)
(MCG_C2[RANGE]=1x)
Input clock frequency (external clock mode)
Input clock duty cycle (external clock mode)
Crystal startup time — 32 kHz low-frequency,
low-power mode (HGO=0)
Crystal startup time — 32 kHz low-frequency,
high-gain mode (HGO=1)
Crystal startup time — 8 MHz high-frequency
(MCG_C2[RANGE]=01), low-power mode
(HGO=0)
Crystal startup time — 8 MHz high-frequency
(MCG_C2[RANGE]=01), high-gain mode
(HGO=1)
Description
Description
Table 16. Oscillator DC electrical specifications (continued)
K40 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Table 17. Oscillator frequency specifications
F
is integrated and must not be attached externally.
Preliminary
Min.
Min.
32
40
3
8
Typ.
Typ.
V
V
750
250
0.6
0.6
0.6
50
1
DD
DD
Max.
Max.
40
32
50
60
8
Freescale Semiconductor, Inc.
MHz
MHz
MHz
Unit
Unit
kHz
ms
ms
ms
ms
%
V
V
V
V
Notes
Notes
2,
1
3

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