PK60X256VMD100 Freescale Semiconductor, PK60X256VMD100 Datasheet - Page 23

• Manufacturer Part Number: PK60X256VMD100
• Description: IC ARM CORTEX MCU 256K 144-MAP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK60X256VMD100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LBGA
• Processor Series: Kinetis
• Core: ARM Cortex M4
• Data Ram Size: 64 KB
• Interface Type: UART, SPI, I2C, I2S, CAN
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 100
• Operating Supply Voltage: 1.71 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

1. The greater synchronous and asynchronous timing must be met.
2. This is the shortest pulse that is guaranteed to be recognized.
3. 75pF load
4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
5.3.2 Thermal attributes
Freescale Semiconductor, Inc.
Single-layer (1s)
Four-layer (2s2p)
Single-layer (1s)
Four-layer (2s2p)
—
—
Board type
Symbol
T
T
J
A
Die junction temperature
Ambient temperature
Description
R
R
R
R
R
R
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
K60 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Table 11. Thermal operating requirements
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to board
Thermal
resistance, junction
to case
Description
Table continues on the next page...
Preliminary
TBD
TBD
TBD
TBD
TBD
TBD
100 LQFP
Min.
–40
–40
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Max.
125
105
1
1
1
1
2
3
Notes
Unit
°C
°C
General
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