MCIMX286CVM4B Freescale Semiconductor, MCIMX286CVM4B Datasheet - Page 5

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MCIMX286CVM4B

Manufacturer Part Number
MCIMX286CVM4B
Description
IC MPU I.MX286 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r

Specifications of MCIMX286CVM4B

Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
The drawing below shows an optimal layout for the top layer placement and routing of the DCDC
converter.
3.3
Freescale Semiconductor
Place the DCDC output capacitors as close as possible to their respective DCDC output pins (less
than 5mm away): DCDC_VDDIO, DCDC_VDDA, DCDC_VDDD.
Place the ground connections of the DCDC_BATT input capacitors as close as possible to both the
DCDC_GND pin and the ground connections of the DCDC output capacitors.
Place the ground connections of the DCDC output capacitors as close as possible to both the
DCDC_GND pin and the ground connections of the DCDC_BATT pin input capacitors.
Route the positive battery terminal on the power plane layer using a minimum trace width of 30
mils (0.762mm). A thicker trace may be required for longer battery trace runs (using a plane is
best).
Connect the negative battery terminal directly to the ground plane(s) as well as to the top and
bottom ground fill using multiple vias (3 or more).
Battery Connection
i.MX28 Layout and Design Guidelines, Rev. 0
PMU and DC-DC Converter
5

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