MCIMX286CVM4B Freescale Semiconductor, MCIMX286CVM4B Datasheet - Page 6

• Manufacturer Part Number: MCIMX286CVM4B
• Description: IC MPU I.MX286 289MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX28r

Specifications of MCIMX286CVM4B

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 454MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Program Memory Size: 128KB (32K x 32)
• Program Memory Type: Mask ROM
• Ram Size: 32K x 32
• Voltage - Supply (vcc/vdd): 1.25 V ~ 5.25 V
• Data Converters: A/D 17x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 289-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of I /o: -
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Analog
4
Place sensitive analog components including the low resolution ADC (LRADC), high speed ADC
(HSADC), crystal circuit, analog audio, etc. in a section of the PCB that is isolated from digital
components and traces.
4.1
4.2
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Try placing the negative battery terminal close to the DCDC_GND pin if possible. This will reduce
the length of the DCDC switching current ground return path and reduce overall PCB noise.
Analog
0.01uF capacitors should be placed close to the LRADC input pins and away from digital and
DCDC components and traces.
The LRADC and HSADC traces should be routed adjacent to a ground plane the entire length of
the trace. Crossing plane splits should be avoided. The traces should be routed far away from
digital and DCDC components and traces.
Minimal capacitance, no greater than 0.01uF, should be placed on the HSADC pin due to its high
sample rate; 2Msps with 12 bit resolution. Placing a large amount of capacitance on the HSADC
trace can reduce the accuracy and conversion speed due to limiting the analog signal rate of change.
The HSADC signal must be routed only adjacent to ground planes – above and below if placed on
an internal layer. It should be routed at least 50 mils away from other traces. At least 50mils of
ground shielding on both sides of trace is recommended as shown below.
Place the crystal and load capacitors as close as possible to the XTALI and XTALO pins.
Place the VDD_XTAL capacitor close to the VDD_XTAL pin, and ground the capacitor away from
digital traces.
These rules apply to both the 24.000 MHz and 32.768 kHz crystal circuits. The drawing below
shows an example layout for the 24.000 MHz crystal circuit. In this drawing, all circuit components
are routed on the top layer above a ground plane.
Analog-to-Digital Converters
Crystal
i.MX28 Layout and Design Guidelines, Rev. 0
Freescale Semiconductor