AFBR-57R6AEZ Avago Technologies US Inc., AFBR-57R6AEZ Datasheet - Page 2

Fiber Optic Transmitters, Receivers, Transceivers Transceiver

AFBR-57R6AEZ

Manufacturer Part Number
AFBR-57R6AEZ
Description
Fiber Optic Transmitters, Receivers, Transceivers Transceiver
Manufacturer
Avago Technologies US Inc.
Series
-r
Datasheet

Specifications of AFBR-57R6AEZ

Product
Transceiver
Data Rate
4.25 GBd, 2.125 GBd, 1.0625 GBd, 1.25 GBd
Wavelength
860 nm (Max)
Maximum Rise Time
0.09 ns/0.15 ns
Maximum Fall Time
0.09 ns/0.15 ns
Pulse Width Distortion
0.06 ns (Max)/0.062 ns (Max)
Maximum Output Current
300 mA
Operating Supply Voltage
2.97 V to 3.63 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 10 C
Package / Case
SFP
Mounting Type
SFP
Voltage - Supply
2.97 V ~ 3.63 V
Connector Type
LC Duplex
Applications
Ethernet
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
Multimode Fiber
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AFBR-57R6AEZ
Manufacturer:
Avago Technologies
Quantity:
135
2
Installation
The AFBR-57R6AEZ can be installed in any SFF-8074i
compliant Small Form Pluggable (SFP) port regardless of
host equipment operating status. The AFBR-57R6AEZ is
hot-pluggable, allowing the module to be installed while
the host system is operating and on-line. Upon insertion,
the transceiver housing makes initial contact with the
host board SFP cage, mitigating potential damage due
to Electro-Static Discharge (ESD).
Digital Diagnostic Interface and Serial Identification
The 2-wire serial interface is based on ATMEL AT24C01A
series EEPROM protocol and signaling detail. Conven-
tional EEPROM memory, bytes 0-255 at memory address
0xA0, is organized in compliance with SFF-8074i. New
digital diag nostic information, bytes 0-255 at memory
address 0xA2, is compliant to SFF-8472. The new diag-
nostic information provides the opportunity for Predic-
tive Failure Identification, Com pliance Prediction, Fault
Isolation and Component Monitoring.
Predictive Failure Identification
The AFBR-57R6AEZ predictive failure feature allows a
host to identify potential link problems before system
performance is impacted. Prior identification of link
problems enables a host to service an application via
“fail over” to a redundant link or replace a suspect device,
maintaining system uptime in the process. For applica-
tions where ultra-high system uptime is required, a digi-
tal SFP provides a means to monitor two real-time laser
metrics asso ciated with observing laser degradation and
predicting failure: average laser bias current (Tx_Bias)
and average laser optical power (Tx_Power).
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-57R6AEZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify po-
tential component compliance issues. Received optical
power is also available to assess compliance of a cable
plant and remote transmitter. When operating out of re-
quirements, the link cannot guarantee error free trans-
mission.
Fault Isolation
The fault isolation feature allows a host to quickly pin-
point the location of a link failure, minimizing downtime.
For optical links, the ability to identify a fault at a local
device, remote device or cable plant is crucial to speed-
ing service of an installation. AFBR-57R6AEZ real-time
monitors of Tx_Bias, Tx_Power, Vcc, Temperature and
Rx_Power can be used to assess local transceiver current
operating conditions. In addition, status flags Tx_Disable
and Rx Loss of Signal (LOS) are mirrored in memory and
available via the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the AFBR-
57R6AEZ real-time monitors of Tx_Bias, Tx_Power, Vcc,
Temperature and Rx_Power. Potential uses are as debug-
ging aids for system installation and design, and trans-
ceiver parametric evaluation for factory or field qualifi-
cation. For example, temperature per module can be
observed in high density applications to facilitate ther-
mal evaluation of blades, PCI cards and systems.

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