A2F500M3G-FGG256 Actel, A2F500M3G-FGG256 Datasheet - Page 88
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A2F500M3G-FGG256
Manufacturer Part Number
A2F500M3G-FGG256
Description
FPGA - Field Programmable Gate Array 500K System Gates
Manufacturer
Actel
Datasheet
1.A2F500M3G-FGG256.pdf
(192 pages)
Specifications of A2F500M3G-FGG256
Processor Series
A2F500
Core
ARM Cortex M3
Number Of Logic Blocks
24
Maximum Operating Frequency
100 MHz
Number Of Programmable I/os
117
Data Ram Size
64 KB
Delay Time
50 ns
Supply Voltage (max)
3.6 V
Supply Current
2 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.5 V
Number Of Gates
500000
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A2F500M3G-FGG256
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A2F500M3G-FGG256I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A2F500M3G-FGG256I
Manufacturer:
MICROSEMI/美高森美
Quantity:
20 000
SmartFusion DC and Switching Characteristics
Table 2-92 • Temperature Monitor Performance Specifications
2- 76
Specification
Input diode temperature range
Temperature sensitivity
Intercept
Input referred temperature offset
error
Gain error
Overall accuracy
Input referred noise
Output current
Analog settling time
AT parasitic capacitance
Power supply rejection ratio
Input referred temperature
sensitivity error
Temperature monitor (TM)
operational power supply current
requirements (per temperature
monitor instance, not including ADC
or VAREFx)
Note:
All results are based on averaging over 64 samples.
Temperature Monitor
Unless otherwise noted, temperature monitor performance is specified with a 2N3904 diode-connected
bipolar transistor from National Semiconductor or Infineon Technologies, nominal power supply voltages,
with the output measured using the internal voltage reference with the internal ADC in 12-bit mode and
62.5 Ksps. After digital compensation. Unless otherwise noted, the specifications pertain to conditions
where the SmartFusion device and the sensing diode are at the same temperature.
Extrapolated to 0K
At 25°C (298.15K)
Peak error from ideal transfer function
Idle mode
Final measurement phases
Measured to 0.1% of final value, (with
ADC load)
DC (0–10 KHz)
Variation due to device temperature
(–40°C to +100°C). External temperature
sensor held constant.
VCC33A
VCC33AP
VCC15A
Slope of BFSL vs. 2.5 mV/K
At 25°C (298.15K) – no output averaging
From TM_STB (High)
From ADC_START (High)
Test Conditions
R e visio n 6
233.2
Min.
–55
1.2
5
5
Typical
0.005
100
200
150
2.5
0.7
±1
±2
10
50
±1
0
4
378.15
0.008
Max.
150
105
500
1.5
2.5
±3
% nom.
°C rms
°C/°C
Units
mV/K
°C/V
µA
µA
pF
µA
µA
µA
°C
°C
°C
µs
µs
K
V