LFXP10E-3FN256I Lattice, LFXP10E-3FN256I Datasheet - Page 115

• Manufacturer Part Number: LFXP10E-3FN256I
• Description: FPGA - Field Programmable Gate Array 9.7K LUTs 188 IO 1.2 V -3 Spd I
• Manufacturer: Lattice

Specifications of LFXP10E-3FN256I

• Number Of Programmable I/os: 188
• Data Ram Size: 221184
• Supply Voltage (max): 1.26 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.14 V
• Package / Case: FPBGA-256
• Number Of Logic Elements/cells: *
• Number Of Labs/clbs: *
• Total Ram Bits: *
• Number Of I /o: *
• Number Of Gates: *
• Voltage - Supply: *
• Mounting Type: *
• Operating Temperature: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Pinout Information
Lattice Semiconductor
LatticeXP Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from 
www.latticesemi.com/software
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