AFS600-FGG484 Actel, AFS600-FGG484 Datasheet - Page 257

FPGA - Field Programmable Gate Array 600K System Gates

AFS600-FGG484

Manufacturer Part Number
AFS600-FGG484
Description
FPGA - Field Programmable Gate Array 600K System Gates
Manufacturer
Actel
Datasheet

Specifications of AFS600-FGG484

Processor Series
AFS600
Core
IP Core
Maximum Operating Frequency
1098.9 MHz
Number Of Programmable I/os
172
Data Ram Size
110592
Supply Voltage (max)
1.575 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
AFS-Eval-Kit, AFS-BRD600, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.425 V
Number Of Gates
600 K
Package / Case
FPBGA-484
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AFS600-FGG484
Manufacturer:
Actel
Quantity:
135
Part Number:
AFS600-FGG484
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
AFS600-FGG484I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
AFS600-FGG484I
Manufacturer:
MICROSEMI/美高森美
Quantity:
20 000
Part Number:
AFS600-FGG484K
Manufacturer:
Microsemi SoC
Quantity:
10 000
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient, case, or board temperatures. This is an important distinction because dynamic and static power
consumption will cause the chip's junction temperature to be higher than the ambient, case, or board
temperatures.
gradient, and power.
where
Table 3-6 • Package Thermal Resistance
θ
θ
θ
T
T
T
T
P
Product
AFS090-QN108
AFS090-QN180
AFS250-QN180
AFS090-FG256
AFS250-FG256
AFS600-FG256
AFS1500-FG256
AFS600-FG484
AFS1500-FG484
JA
JB
JC
A
J
B
C
= Junction-to-air thermal resistance
= Junction-to-board thermal resistance
= Junction-to-case thermal resistance
= Junction temperature
= Ambient temperature
= Board temperature (measured 1.0 mm away from the
= Case temperature
= Total power dissipated by the device
package edge)
EQ 1
through
X = 7.62; Y = 9.98
X = 7.62; Y = 9.98
X = 5.10; Y = 7.3
X = 5.10; Y = 7.3
X = 3.4; Y = 4.8
X = 3.4; Y = 4.8
X = 4.0; Y = 5.6
X = 3.4; Y = 4.8
X = 4.0; Y = 5.6
Die Size
(mm)
EQ 3
give the relationship between thermal resistance, temperature
Still Air
R e v i s i o n 1
θ
θ
θ
JC
JA
JB
34.5
33.3
32.2
37.7
33.7
28.9
23.3
21.8
21.6
=
=
=
T
----------------- -
T
------------------ -
T
------------------ -
J
J
J
P
P
P
1.0 m/s
θ
T
T
30.0
27.6
26.5
33.9
30.0
25.2
19.6
18.2
16.8
θ
A
B
C
JA
Actel Fusion Family of Mixed Signal FPGAs
2.5 m/s
27.7
25.7
24.7
32.2
28.3
23.5
18.0
16.7
15.2
11.5
θ
8.1
9.2
5.7
9.3
6.8
4.3
7.7
5.6
JC
16.7
21.2
15.0
29.7
24.8
19.9
14.2
16.8
14.9
θ
JB
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
EQ 1
EQ 2
EQ 3
3 -7

Related parts for AFS600-FGG484