PCF8564ACX9/B/1,02 NXP Semiconductors, PCF8564ACX9/B/1,02 Datasheet - Page 38

• Manufacturer Part Number: PCF8564ACX9/B/1,02
• Description: IC RTC/CALENDAR
• Manufacturer: NXP Semiconductors
• Type: Clock/Calendar/Alarmr

Specifications of PCF8564ACX9/B/1,02

• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Function: Serial Clock, Alarm, Calendar, Timer, Timer Interrupt
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1 V
• Mounting Style: SMD/SMT
• Rtc Bus Interface: I2C
• Supply Current: 1700 nA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: 568-6424-2; PCF8564ACX9/B/1,02

NXP Semiconductors
PCF8564A
Product data sheet
19.2 Board mounting
19.3 Reflow soldering
All NXP WLCSP packages are lead-free.
Board mounting of a WLCSP requires several steps:
Key characteristics in reflow soldering are:
Table 36.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with
Lead-free process (from J-STD-020C)
Figure
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 30 September 2010
35.
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
)
Figure
350 to 2000
260
250
245
Table
35) than a PbSn process, thus
36.
Real time clock and calendar
PCF8564A
> 2000
260
245
245
© NXP B.V. 2010. All rights reserved.
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