XC3S50AN-5FTG256C Xilinx Inc, XC3S50AN-5FTG256C Datasheet - Page 64

• Manufacturer Part Number: XC3S50AN-5FTG256C
• Description: IC FPGA SPARTAN-3AN 256FTBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S50AN-5FTG256C

• Number Of Logic Elements/cells: 1584
• Number Of Labs/clbs: 176
• Total Ram Bits: 55296
• Number Of I /o: 195
• Number Of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 6: Status and Information Commands
64
READY/BUSY
READY/BUSY status of the In-System Flash (ISF) memory is indicated by bit 7 in the
Status
Table 6-2: READY/BUSY
There are several commands that cause a busy condition.
•
•
•
•
•
•
•
•
•
•
Even while the ISF memory is busy, the FPGA application can potentially issue the
following commands.
•
•
•
READY/BUSY
Page to Buffer Transfer
Page to Buffer Compare (Program Verify)
Buffer to Page Program with Built-in Erase
Buffer to Page Program without Built-in Erase
Page Program Through Buffer
Page Erase
Block Erase
Sector Erase
Information Read
Auto Page Rewrite
Read from or write to an SRAM page buffer that is not involved in the present
operation.
♦
♦
Status Register Read
Information Read
Register, as defined in
Buffer Read
Buffer Write
0
1
BUSY: The ISF memory is busy completing a command that accesses the
internal array. Even while the ISF memory is busy, the FPGA application
can issue select commands, as described below.
READY: The ISF memory is ready to accept any command. Any previous
commands have completed.
www.xilinx.com
(Status Register
Table
6-2.
Spartan-3AN FPGA In-System Flash User Guide
Bit 7)
Description
UG333 (v2.1) January 15, 2009
R