MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 43
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MB9BF104RPMC-GE1
Manufacturer Part Number
MB9BF104RPMC-GE1
Description
IC MCU 32BIT 256KB FLASH 120LQFP
Manufacturer
Fujitsu Semiconductor America Inc
Series
FM3 MB9B100r
Datasheets
1.MB9BF104NPMC-G-JNE1.pdf
(100 pages)
2.MB9BF104NPMC-G-JNE1.pdf
(4 pages)
3.MB9BF104RPMC-GE1.pdf
(1 pages)
Specifications of MB9BF104RPMC-GE1
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
80MHz
Connectivity
CSIO, EBI/EMI, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
100
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
120-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
865-1117
PRECAUTIONS FOR HANDLING THE DEVICES
DS706-00007-1v0-E
Precautions for Product Design
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly
affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This
page describes precautions that must be observed to minimize the chance of failure and to obtain higher
reliability from your FUJITSU semiconductor devices.
This section describes precautions when designing electronic equipment using semiconductor devices.
・ Absolute Maximum Ratings
・ Recommended Operating Conditions
・ Processing and Protection of Pins
・ Latch-up
Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the
data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
These precautions must be followed when handling the pins which connect semiconductor devices to
power supply and input/output functions.
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate.
When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor
structures) may be formed, causing large current levels in excess of several hundred mA to flow
continuously at the power supply pin. This condition is called latch-up.
1. Preventing Over-Voltage and Over-Current Conditions
2. Protection of Output Pins
3. Handling of Unused Input Pins
Note:
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause
deterioration within the device, and in extreme cases leads to permanent damage of the device. Try
to prevent such overvoltage or over-current conditions at the design stage.
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can
cause large current flows. Such conditions if present for extended periods of time can damage the
device.
Therefore, avoid this type of connection.
Unconnected input pins with very high impedance levels can adversely affect stability of operation.
Such pins should be connected through an appropriate resistance to a power supply pin or ground
pin.
The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but
can cause injury or damage from high heat, smoke or flame. To prevent this from happening,
do the following:
(a) Be sure that voltages applied to pins do not exceed the absolute maximum ratings.
(b) Be sure that abnormal current flows do not occur during the power-on sequence.
This should include attention to abnormal noise, surge levels, etc.
MB9B100 Series
43