MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 94
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MB9BF104RPMC-GE1
Manufacturer Part Number
MB9BF104RPMC-GE1
Description
IC MCU 32BIT 256KB FLASH 120LQFP
Manufacturer
Fujitsu Semiconductor America Inc
Series
FM3 MB9B100r
Datasheets
1.MB9BF104NPMC-G-JNE1.pdf
(100 pages)
2.MB9BF104NPMC-G-JNE1.pdf
(4 pages)
3.MB9BF104RPMC-GE1.pdf
(1 pages)
Specifications of MB9BF104RPMC-GE1
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
80MHz
Connectivity
CSIO, EBI/EMI, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
100
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
120-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
865-1117
(Continued)
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
94
MB9B100 Series
C
100-pin plastic LQFP
2009-2010 FUJITSU SEMICONDUCTOR LIMITED F100034S-c-3-4
100
76
(FPT-100P-M23)
75
1
INDEX
0.50(.020)
*
16.00±0.20(.630 ±.008)S Q
14.00±0.10(.551 ±.004)S Q
100-pin plastic LQFP
(FPT-100P-M23)
(.009±.002)
0.22±0.05
51
25
0.08(.003)
50
26
M
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
0.145±0.055
(.006±.002)
"A"
Package width ×
Mounting height
Sealing method
package length
0.08(.003)
Lead shape
Lead bend
Lead pitch
direction
Weight
Details of "A" pa r t
(Mounting height)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
(
1.50
.059 -.004
(.020±.008)
(.024±.006)
0.50±0.20
0.60±0.15
0°~8°
+.008
+0.20
- 0.10
)
14.00 mm × 14.00 mm
DS706-00007-1v0-E
1.70 mm MAX
Normal bend
Plastic mold
0.25(.010)
0.50 mm
Gullwing
(.004±.004)
(Stand off)
0.65 g
0.10±0.10