MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 96
![no-image](/images/no-image-200.jpg)
MB9BF104RPMC-GE1
Manufacturer Part Number
MB9BF104RPMC-GE1
Description
IC MCU 32BIT 256KB FLASH 120LQFP
Manufacturer
Fujitsu Semiconductor America Inc
Series
FM3 MB9B100r
Datasheets
1.MB9BF104NPMC-G-JNE1.pdf
(100 pages)
2.MB9BF104NPMC-G-JNE1.pdf
(4 pages)
3.MB9BF104RPMC-GE1.pdf
(1 pages)
Specifications of MB9BF104RPMC-GE1
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
80MHz
Connectivity
CSIO, EBI/EMI, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
100
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
120-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
865-1117
- MB9BF104NPMC-G-JNE1 PDF datasheet
- MB9BF104NPMC-G-JNE1 PDF datasheet #2
- MB9BF104RPMC-GE1 PDF datasheet #3
- Current page: 96 of 100
- Download datasheet (2Mb)
(Continued)
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
96
MB9B100 Series
C
112-ball plastic PFBGA
2003-2010 FUJITSU SEMICONDUCTOR LIMITED B112004S-c-2-3
10.00±0.10
(BGA-112P-M04)
(.394±.004)
0.20(.008)
112-ball plastic PFBGA
(INDEX AREA)
10.00±0.10(.394±.004)
(BGA-112P-M04)
S
A
0.10(.004) S
(.014±.004)
(Stand off)
0.35±0.10
0.20(.008) S B
(.049±.008)
(Seated height)
1.25±0.20
S
Package width ×
Mounting height
Sealing method
package length
0.80(.031)
Lead shape
REF
A
Ball pitch
Ball size
Weight
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
(112-Ф0.18±.004)
112-Ф0.45±010
L
K
J
H
B
G
10.00 × 10.00 mm
Ф0.08(.003)
F
DS706-00007-1v0-E
1.45 mm Max.
Soldering ball
Plastic mold
E D C B A
Ф 0.45 mm
0.80 mm
0.22 g
M
0.80(.031)
S
REF
INDEX
A
B
10
11
4
9
8
7
6
5
3
2
1
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