MPC8313E-RDBC Freescale Semiconductor, MPC8313E-RDBC Datasheet - Page 64

• Manufacturer Part Number: MPC8313E-RDBC
• Description: BOARD CPU 8313E VER 2.2
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MPUr

Specifications of MPC8313E-RDBC

• Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: MPC8313E

Package and Pin Listings
19.2
Figure 56
package.
64
Figure 56. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8313E TEPBGAII
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Package code 5368 is to account for PGE and the built-in heat spreader.
Mechanical Dimensions of the MPC8313E TEPBGAII
shows the mechanical dimensions and bottom surface nomenclature of the 516-TEPBGAII
MPC8313E PowerQUICC
™
II Pro Processor Hardware Specifications, Rev. 3
Freescale Semiconductor