ADSP-BF538BBCZ-5F4 Analog Devices Inc, ADSP-BF538BBCZ-5F4 Datasheet - Page 51

• Manufacturer Part Number: ADSP-BF538BBCZ-5F4
• Description: IC, FLOAT-PT DSP, 16BIT, 533MHZ, BGA-316
• Manufacturer: Analog Devices Inc
• Series: Blackfinr
• Type: Fixed Pointr

Specifications of ADSP-BF538BBCZ-5F4

• No. Of Bits: 16 Bit
• Frequency: 533MHz
• Supply Voltage: 1.25V
• Embedded Interface Type: CAN, I2C, PPI, SPI, TWI, UART
• No. Of I/o's: 54
• Flash Memory Size: 512KB
• Interface: CAN, SPI, SSP, TWI, UART
• Clock Rate: 533MHz
• Non-volatile Memory: FLASH (512 kB)
• On-chip Ram: 148kB
• Voltage - I/o: 3.00V, 3.30V
• Voltage - Core: 1.25V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 316-CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADZS-BFAUDIO-EZEXT - BOARD EVAL AUDIO BLACKFIN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use
where
T
T
center of package.
Ψ
P
the method to calculate P
D
J
CASE
JT
= Junction temperature ( C)
= Power dissipation (see
= From
135
110
124
104
130
125
120
115
100
120
116
112
108
100
= Case temperature ( C) measured by customer at top
0
Figure 50. Typical Output Fall Times (10% to 90%) vs. Load
0
Figure 51. Typical Output Fall Times (10% to 90%) vs. Load
Table 35
Capacitance for Driver E at V
Capacitance for Driver E at V
50
50
T
J
=
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
T
D
CASE
)
Power Dissipation on Page 48
100
100
+
(
Ψ
DDEXT
DDEXT
JT
FALL TIME
FALL TIME
150
150
×
= 3.6 V (Max)
= 2.7 V (Min)
P
D
)
Rev. A | Page 51 of 56 | January 2008
200
200
for
250
250
Values of θ
circuit board design considerations. θ
order approximation of T
where:
T
Values of θ
circuit board design considerations when an external heatsink is
required.
Values of θ
circuit board design considerations.
In
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Table 35. Thermal Characteristics BC-316 Without Flash
Table 36. Thermal Characteristics BC-316 With Flash
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
A
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JT
JT
JT
JT
JT
Table
= Ambient temperature ( C)
35, airflow measurements comply with JEDEC stan-
JA
JC
JB
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
ADSP-BF538/ADSP-BF538F
T
J
=
J
T
by the equation
A
+
(
θ
JA
×
JA
P
can be used for a first
D
)
21.6
18.8
18.1
0.13
0.25
0.25
20.9
18.1
17.4
0.12
0.24
0.24
Typical
5.36
Typical
5.01
Unit
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W