PIC16F1827-I/ML Microchip Technology, PIC16F1827-I/ML Datasheet - Page 99
![IC, 8BIT MCU, PIC16F, 32MHZ, QFN-28](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC16F1827-I/ML
Manufacturer Part Number
PIC16F1827-I/ML
Description
IC, 8BIT MCU, PIC16F, 32MHZ, QFN-28
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16F1826-IP.pdf
(406 pages)
3.PIC16F1826-IP.pdf
(12 pages)
4.PIC16F1826-IP.pdf
(8 pages)
5.PIC16F1826-IP.pdf
(40 pages)
6.PIC16LF1827-ISS.pdf
(400 pages)
Specifications of PIC16F1827-I/ML
Controller Family/series
PIC16F
Eeprom Memory Size
256Byte
Ram Memory Size
384Byte
Cpu Speed
32MHz
No. Of Timers
5
Interface
EUSART, I2C, SPI
Core Size
8 Bit
Program Memory Size
4kWords
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
15
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC16F722-ISS PDF datasheet
- PIC16F1826-IP PDF datasheet #2
- PIC16F1826-IP PDF datasheet #3
- PIC16F1826-IP PDF datasheet #4
- PIC16F1826-IP PDF datasheet #5
- PIC16LF1827-ISS PDF datasheet #6
- Current page: 99 of 400
- Download datasheet (7Mb)
9.0
The Power-Down mode is entered by executing a
SLEEP instruction.
Upon entering Sleep mode, the following conditions exist:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Resets other than WDT are not affected by
Refer to individual chapters for more details on periph-
eral operation during Sleep.
To minimize current consumption, the following condi-
tions should be considered:
• I/O pins should not be floating
• External circuitry sinking current from I/O pins
• Internal circuitry sourcing current from I/O pins
• Current draw from pins with internal weak pull-ups
• Modules using 31 kHz LFINTOSC
• Modules using Timer1 oscillator
I/O pins that are high-impedance inputs should be
pulled to V
rents caused by floating inputs.
Examples of internal circuitry that might be sourcing
current include modules such as the DAC and FVR
modules. See Section 16.0 “Digital-to-Analog Con-
verter (DAC) Module” and Section 14.0 “Fixed Volt-
age Reference (FVR)” for more information on these
modules.
© 2009 Microchip Technology Inc.
WDT will be cleared but keeps running, if
enabled for operation during Sleep.
PD bit of the STATUS register is cleared.
TO bit of the STATUS register is set.
CPU clock is disabled.
31 kHz LFINTOSC is unaffected and peripherals
that operate from it may continue operation in
Sleep.
Timer1 oscillator is unaffected and peripherals
that operate from it may continue operation in
Sleep.
ADC is unaffected, if the dedicated FRC clock is
selected.
Capacitive Sensing oscillator is unaffected.
I/O ports maintain the status they had before
SLEEP was executed (driving high, low or high-
impedance).
Sleep mode.
POWER-DOWN MODE (SLEEP)
DD
or V
SS
externally to avoid switching cur-
Preliminary
9.1
The device can wake-up from Sleep through one of the
following events:
1.
2.
3.
4.
5.
6.
The first three events will cause a device Reset. The
last three events are considered a continuation of pro-
gram execution. To determine whether a device Reset
or wake-up event occurred, refer to Section 7.10
“Determining the Cause of a Reset”.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP instruction, the device will call the Interrupt Ser-
vice Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
External Reset input on MCLR pin, if enabled
BOR Reset, if enabled
POR Reset
Watchdog Timer, if enabled
Any external interrupt
Interrupts by peripherals capable of running dur-
ing Sleep (see individual peripheral for more
information)
PIC16F/LF1826/27
Wake-up from Sleep
DS41391B-page 99
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