DSPIC30F6011A-20E/PT Microchip Technology, DSPIC30F6011A-20E/PT Datasheet - Page 209
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DSPIC30F6011A-20E/PT
Manufacturer Part Number
DSPIC30F6011A-20E/PT
Description
Digital Signal Processor
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F5011-20IPT.pdf
(220 pages)
4.DSPIC30F6011A-30IPT.pdf
(234 pages)
5.DSPIC30F6011A-30IPT.pdf
(8 pages)
6.DSPIC30F6011A-30IPT.pdf
(10 pages)
7.DSPIC30F6011A-30IPT.pdf
(6 pages)
8.DSPIC30F6011A-30IPT.pdf
(8 pages)
9.DSPIC30F6011A-30IPT.pdf
(16 pages)
Specifications of DSPIC30F6011A-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
52
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6011A-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6011A-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
APPENDIX A:
Revision F (May 2006)
Previous versions of this data sheet contained
Advance or Preliminary Information. They were distrib-
uted with incomplete characterization data.
Revision F of this document reflects the following
updates:
• Supported I
• ADC Conversion Clock selection to allow 200 kHz
• Operating Current (Idd) Specifications
• BOR voltage limits
• I/O pin Input Specifications
• Watchdog Timer time-out limits
Revision G (January 2007)
This revision includes updates to the packaging
diagrams.
© 2011 Microchip Technology Inc.
(see
sampling rate (see
to-Digital Converter (ADC) Module”
(see
(see
(see
(see
Table
Table
Table
Table
Table
15-1)
23-5)
23-11)
23-8)
23-21)
2
C Slave Addresses
Section 19.0 “12-bit Analog-
REVISION HISTORY
Revision H (March 2008)
This revision includes the following updates:
• Added FUSE Configuration Register (FICD)
• Updated FGS Configuration register details (see
• Removed erroneous statement regarding genera-
• Electrical Specifications:
• Additional minor corrections throughout the
details (see
Registers”
Table
tion of CAN receive errors (see
“Receive
- Resolved TBD values for parameters DO10,
- 10-bit High-Speed ADC t
- Parameter OS65 (Internal RC Accuracy) has
- Parameter DC12 (RAM Data Retention Volt-
- Parameter D134 (Erase/Write Cycle Time)
- Removed parameters OS62 (Internal FRC
- Parameter OS63 (Internal FRC Accuracy)
- Updated Min and Max values and Conditions
document
dsPIC30F5011/5013
DO16, DO20, and DO26 (see
ter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table
age) has been updated to include a Min value
(see
has been updated to include Min and Max
values and the Typ value has been removed
(see
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table
has been expanded to reflect multiple Min
and Max values for different temperatures
(see
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for parame-
ter SY20 (see
20-8)
Table
Table
Table
23-39)
23-19)
23-18)
Errors”)
Section 20.7 “Device Configuration
and
23-4)
23-12)
23-18)
Table
Table
20-8)
23-21)
PDU
timing parame-
Section 17.4.5
Table
DS70116J-page 209
23-9)