PIC16F636T-I/ML Microchip Technology, PIC16F636T-I/ML Datasheet - Page 219
![IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,16PIN,PLASTIC](/photos/6/65/66536/mfg_mcp7386x_qfn_sml.jpg)
PIC16F636T-I/ML
Manufacturer Part Number
PIC16F636T-I/ML
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,16PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
Specifications of PIC16F636T-I/ML
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
16-QFN
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232, SPI, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNXLT16QFN1 - SOCKET TRANSITION 14DIP TO 16QFNAC162057 - MPLAB ICD 2 HEADER 14DIP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- Current page: 219 of 234
- Download datasheet (4Mb)
14-Lead Plastic Dual In-Line (P or PD) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
© 2007 Microchip Technology Inc.
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
PIC12F635/PIC16F636/639
Units
eB
A2
A1
E1
b1
N
A
E
D
e
L
c
b
A2
E1
.115
.015
.290
.240
.735
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
.310
.750
.130
.060
.018
.130
.250
.010
14
–
–
–
Microchip Technology Drawing C04-005B
MAX
.210
.195
.325
.280
.775
.150
.015
.070
.022
.430
eB
–
E
DS41232D-page 217
c
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