APDS-9801 Avago Technologies US Inc., APDS-9801 Datasheet - Page 24

• Manufacturer Part Number: APDS-9801
• Description: INTEGRATED DIGITAL PS AND ALS
• Manufacturer: Avago Technologies US Inc.
• Type: Analog Ambient Light Sensor and Digital Proximity Sensorr

Specifications of APDS-9801

• Peak Wavelength: 940 nm
• Maximum Light Current: 83 uA
• Maximum Dark Current: 300 nA
• Maximum Rise Time: 1000 ns
• Maximum Fall Time: 300 ns
• Mounting Style: SMD/SMT
• Product: Integrated Ambient Light and Proximity Sensor
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Recommended Reflow Profile
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different 'T/'time tem-
perature change rates or duration. The 'T/'time rates or
duration are detailed in the above table. The temperatures
are measured at the component to printed circuit board
connections.
In
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is
limited to 3°C per second to allow for even heating of both
the PC board and component pins.
Process zone P2
to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder.
Process zone P3
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Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2573EN - September 6, 2010
process zone P1
200
120
255
230
217
180
150
80
25
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above liquidus point, 217°C
Peak Temperature
Time within 5°C of actual Peak Temperature
Time 25°C to Peak Temperature
0
should be of sufficient time duration (100
is the solder reflow zone. In zone P3, the
, the PC board and component pins are
HEAT
R1
P1
UP
50
R2
SOLDER PASTE DRY
100
P2, R2
P3, R3
P3, R4
P4, R5
Symbol
P1, R1
P2
150
'T
25°C to 150°C
150°C to 200°C
200°C to 260°C
260°C to 200°C
200°C to 25°C
> 217°C
260°C
> 255°C
25°C to 260°C
www.avagotech.com
temperature is quickly raised above the liquidus point
of solder to 260°C (500°F) for optimum results. The dwell
time above the liquidus point of solder should be between
60 and 120 seconds. This is to assure proper coalescing
of the solder paste into liquid solder and the formation
of good solder connections. Beyond the recommended
dwell time the intermetallic growth within the solder con-
nections becomes excessive, resulting in the formation of
weak and unreliable connections. The temperature is then
rapidly reduced to a point below the solidus temperature
of the solder to allow the solder within the connections to
freeze solid.
Process zone P4
cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and
component pins to change dimensions evenly, putting
minimal stresses on the component.
It is recommended to perform reflow soldering no more
than twice.
R3
60 sec to 120 sec
Above 217 C
MAX 260C
200
REFLOW
SOLDER
P3
R4
is the cool down after solder freeze. The
Maximum 'T/
'time or Duration
3°C/s
100s to 180s
3°C/s
-6°C/s
-6°C/s
60s to 120s
–
20s to 40s
8mins
COOL DOWN
250
P4
R5
(SECONDS)
t-TIME
300