JN5139/001,515 NXP Semiconductors, JN5139/001,515 Datasheet - Page 72

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JN5139/001,515

Manufacturer Part Number
JN5139/001,515
Description
IC MCU 32BIT 56QFN
Manufacturer
NXP Semiconductors
Datasheet

Specifications of JN5139/001,515

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
A.5.3 Reel Information: 330mm Reel
All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres.
3 window design to allow adequate labelling space.
A.5.4
Moisture sensitive material, as classified by JEDEC standard J-STD-033, must be dry packed. The 56 lead QFN
package is MSL2A/260
67.5 grams of activated clay and a 6 spot humidity indicator card (HIC) meeting MIL-L-8835 specification. The MBB
has a moisture-sensitivity caution label to indicate the moisture-sensitive classification of the enclosed devices.
72
Surface Resistivity
Material
Tape Width
Dry Pack Requirement for Moisture Sensitive Material
16
°
C, and is dried before sealing in a moisture barrier bag (MBB) with desiccant bag weighing at
330
A
Between 10e
High Impact Polystyrene with Antistatic Additive
B (min)
1.5
9
– 10e
13 +0.5 -0.2
JN-DS-JN5139 1v9
11
C
Ohms Square
D (min)
20.2
N (min)
100
W (min)
© NXP Laboratories UK 2010
15.90
W (max)
19.40

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