HSDL-3021-021 Lite-On Electronics, HSDL-3021-021 Datasheet - Page 11

• Manufacturer Part Number: HSDL-3021-021
• Description: Infrared Transceivers IR Transceiver 4.0Mb/s
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3021-021

• Wavelength: 885 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 10 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

HSDL-3021 Moisture Proof Packaging
All HSDL-3021 options are shipped in moisture proof
package. Once opened, moisture absorption begins.
This part is compliant to JEDEC Level 4.
Figure 3. Baking conditions chart.
11
IS NECESSARY
NO BAKING
YES
PERFORM RECOMMENDED
PACKAGE IS OPENED
BAKING CONDITIONS
UNITS IN A SEALED
MOISTURE-PROOF
LESS THAN 30¡C,
AND LESS THAN
THAN 72 HOURS
ENVIRONMENT
OPENED LESS
PACKAGE IS
(UNSEALED)
PACKAGE
60% RH
NO
YES
NO
Recommended Storage Conditions
Storage Temperature 10°C to 30°C
Relative Humidity
Time From Unsealing To Soldering
After removal from the bag, the parts should be soldered
within three days if stored at the recom-mended storage
conditions. When MBB (Moisture Barrier Bag) is opened
and the parts are exposed to the recommended storage
conditions more than three days but less than 15 days,
the parts must be baked before reflow to prevent dam-
age to the parts.
Note: Using the parts that are exposed for more than 15 days is not
recommended.
Baking Conditions
Package
In reels
In bulk
Note: Baking should only be done once.
Temp
60°C
100°C
125°C
Below 60% RH
Time
≥ 48 hours
≥ 4 hours
≥ 2 hours