HSDL-3021-021 Lite-On Electronics, HSDL-3021-021 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3021-021
• Description: Infrared Transceivers IR Transceiver 4.0Mb/s
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3021-021

• Wavelength: 885 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 10 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Reflow Profile
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above
liquidus point, 217°C
Peak Temperature
Time within 5°C of actual
Peak Temperature
Time 25°C to Peak Temperature
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow sol-
der process. The temperature profile is divided into four
process zones, each with different DT/Dtime tempera-
ture change rates, or duration. The DT/Dtime rates, or du-
ration, are detailed in the above table. The temperatures
are measured at the component to printed circuit board
connections.
In process zone P1, the PC board and HSDL-3021 pins are
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is
limited to 3°C per second to allow for even heating of
both the PC board and HSDL-3021 pins.
Process zone P2 should be of sufficient time duration (100
to 180 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the
solder.
12
255
230
217
200
180
150
120
80
25
0
HEAT
R1
UP
P1
50
SOLDER PASTE DRY
R2
100
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
P2
t-TIME (SECONDS)
150
R3
60 sec.to 90 sec.
MAX. 260°C
REFLOW
SOLDER
ABOVE
200
217°C
P3
R4
DT
25°C to 150°C
150°C to 200°C
200°C to 260°C
260°C to 200°C
200°C to 25°C
>217°C
260°C
–
25°C to 260°C
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point
of solder to 260°C (500°F) for optimum results. The dwell
time above the liquidus point of solder should be be-
tween 60 and 90 seconds. This is to assure proper co-
alescing of the solder paste into liquid solder and the
formation of good solder connections. Beyond the rec-
ommended dwell time, the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below
the solidus temperature of the solder to allow the solder
within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The
cool down rate, R5, from the liquidus point of the solder
to 25°C (77°F) should not exceed 6°C per second maxi-
mum. This limitation is necessary to allow the PC board
and HSDL-3021 pins to change dimensions evenly, put-
ting minimal stresses on the HSDL-3021.
It is recommended to perform reflow soldering no more
than twice.
DOWN
250
COOL
P4
R5
300
Maximum DT/DTime or Duration
3°C/s
100s to 180s
3°C/s
-6°C/s
-6°C/s
60s to 90s
–
20s to 40s
8 mins