HT1MO2S3E3M-T NXP Semiconductors, HT1MO2S3E3M-T Datasheet - Page 2

• Manufacturer Part Number: HT1MO2S3E3M-T
• Description: RFID Modules & Development Tools HITAG 1 MOA2 MODULE
• Manufacturer: NXP Semiconductors

Specifications of HT1MO2S3E3M-T

• Operating Current: 30 mA
• Operating Voltage: 3.1 V to 4.2 V
• Product: RFID Transponders
• Wireless Frequency: 125 KHz
• Dimensions: 7.55 mm x 11.75 mm x 0.45 mm
• Operating Temperature Range: - 25 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: HT1MOA2S30/E/3,118

Table of Contents
1 Definitions .............................................................................................................................. 3
2 Specifications ......................................................................................................................... 4
3 Drawing of the Chip Module HT1 MOA3 S30..................................................................... 7
4 Coil Specifications................................................................................................................ 10
5 Functional Description of HITAG 1 ................................................................................... 12
6 Quality Inspection ............................................................................................................... 19
7 Characterisation and Test of the Final Transponder......................................................... 20
8 Ordering Information.......................................................................................................... 21
HITAG
Ht1moa3.doc/HS
Specifications of the HT1 MOA3 S30
1.1 Objective of the Specifications ..................................................................................................................... 3
1.2 Definition of the Chip Module ..................................................................................................................... 3
1.3 Use of the Modules ...................................................................................................................................... 3
2.1 Mechanical Properties ................................................................................................................................. 4
2.2 Materials ..................................................................................................................................................... 4
2.3 Temperature Range .......................................................................................................... . .......................... 4
2.4 Storage Conditions ...................................................................................................................................... 5
2.5 Delivery Conditions..................................................................................................................................... 5
2.6 Electrical Specifications............................................................................................................................... 6
3.1 Drawing of the Reel..................................................................................................................................... 7
3.2 Module outline suggestion ........................................................................................................................... 8
3.3 Splicing Specification .................................................................................................................................. 9
5.1 Memory Organization................................................................................................................................ 12
5.2 Anticollision.............................................................................................................................................. 13
5.3 Operation Modes and Configuration .......................................................................................................... 14
5.4 Configuration of Delivered HITAG 1 Transponders................................................................................... 17
5.5 Definition of Keys and Logdata ................................................................................................................. 17
7.1 Characterisation of the Transponder .......................................................................................................... 20
7.2 Final Test of the Transponder .................................................................................................................... 20
5.3.1 Modes of Operation............................................................................................................................ 14
5.3.2 Configuration..................................................................................................................................... 14
TM
is a trademark of Philips Electronics N.V.
Page 2 of 24
Rev. 1.1
1997-08-19