HT1MO2S3E3M-T NXP Semiconductors, HT1MO2S3E3M-T Datasheet - Page 3

• Manufacturer Part Number: HT1MO2S3E3M-T
• Description: RFID Modules & Development Tools HITAG 1 MOA2 MODULE
• Manufacturer: NXP Semiconductors

Specifications of HT1MO2S3E3M-T

• Operating Current: 30 mA
• Operating Voltage: 3.1 V to 4.2 V
• Product: RFID Transponders
• Wireless Frequency: 125 KHz
• Dimensions: 7.55 mm x 11.75 mm x 0.45 mm
• Operating Temperature Range: - 25 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: HT1MOA2S30/E/3,118

Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
1 Definitions
1.1 Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 1 chip module
HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs).
1.2 Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The
HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless
smart cards according to ISO 10536.1.
So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to
spend time with micro assembly and therefore start - e.g. ISO card production - with the
HITAG 1 chip module.
1.3 Use of the Modules
The HITAG 1 modules are designed to be connected to a coil and then to be further processed by
packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing
information for the coil-module connection and packaging is given in the specification.
For production of contactless chip cards it is recommended to prepunch card foils to create a
recess for the chip module in the card body.
Ht1moa3.doc/HS
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