AD9522-5BCPZ Analog Devices Inc, AD9522-5BCPZ Datasheet - Page 54
![12- Channel Clock Generator With Integra](/photos/6/50/65021/505-64-lfcsp_sml.jpg)
AD9522-5BCPZ
Manufacturer Part Number
AD9522-5BCPZ
Description
12- Channel Clock Generator With Integra
Manufacturer
Analog Devices Inc
Type
Clock Generator, Fanout Distributionr
Datasheet
1.AD9522-5BCPZ-REEL7.pdf
(76 pages)
Specifications of AD9522-5BCPZ
Pll
Yes
Input
CMOS, LVDS, LVPECL
Output
CMOS, LVDS
Number Of Circuits
1
Ratio - Input:output
2:12, 2:24
Differential - Input:output
Yes/Yes
Frequency - Max
2.4GHz
Divider/multiplier
Yes/No
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-LFCSP
Frequency-max
800MHz
Ic Interface Type
I2C, SPI
Frequency
2.4GHz
No. Of Outputs
12
No. Of Multipliers / Dividers
4
Supply Voltage Range
3.135V To 3.465V
Digital Ic Case Style
LFCSP
No. Of Pins
64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD9522-5BCPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD9522-5
THERMAL PERFORMANCE
Table 42. Thermal Parameters for the 64-Lead LFCSP
Symbol
θ
θ
θ
Ψ
θ
Ψ
The AD9522 is specified for a case temperature (T
that T
Use the following equation to determine the junction
temperature on the application PCB:
where:
T
T
top center of the package.
Ψ
PD is the power dissipation (see the total power dissipation in
Table 15).
JA
JMA
JMA
JC
J
CASE
JB
JT
JT
is the junction temperature (°C).
is the value from Table 42.
T
is the case temperature (°C) measured by the user at the
CASE
J
= T
is not exceeded, an airflow source can be used.
CASE
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
+ (Ψ
JT
× PD)
CASE
). To ensure
Rev. 0 | Page 54 of 76
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of Ψ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
A
JA
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
by the equation
JA
can be used for a first-order
Value (°C/W)
22.0
19.2
17.2
11.6
1.3
0.1