AD9739BBC Analog Devices Inc, AD9739BBC Datasheet - Page 53
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AD9739BBC
Manufacturer Part Number
AD9739BBC
Description
14 Bit 2.5 GSPS DAC
Manufacturer
Analog Devices Inc
Datasheet
1.AD9739BBCZ.pdf
(56 pages)
Specifications of AD9739BBC
Number Of Bits
14
Data Interface
Serial
Number Of Converters
1
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
980mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
160-CSPBGA
Number Of Channels
1
Resolution
14b
Interface Type
LVDS
Single Supply Voltage (typ)
3.3V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Analog and Digital
Output Type
Current
Integral Nonlinearity Error
±1.3LSB
Single Supply Voltage (min)
3.1V
Single Supply Voltage (max)
3.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
160
Package Type
CSP-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Settling Time
-
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD9739BBCZ
Manufacturer:
EXAR
Quantity:
101
Company:
Part Number:
AD9739BBCZ
Manufacturer:
Analog Devices Inc
Quantity:
135
Part Number:
AD9739BBCZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9739BBCZ
AD9739BBCZRL
AD9739BBC
AD9739BBCRL
AD9739-EBZ
AD9739-MIX-EBZ
AD9739-CMTS-EBZ
1
Z = RoHs Compliant Part.
1
1
1
1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
1.40 MAX
Figure 111. 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
BALL A1
INDICATOR
TOP VIEW
12.10
12.00 SQ
11.90
COMPLIANT TO JEDEC STANDARDS MO-205-AE.
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board for Normal Mode Evaluation
Evaluation Board for Mix Mode Evaluation
Evaluation Board for CMTS Evaluation
Package Description
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Dimensions shown in millimeters
0.43 MAX
0.25 MIN
Rev. 0 | Page 53 of 56
(BC-160-1)
BSC SQ
10.40
REF
0.80
BALL DIAMETER
0.55
0.50
0.45
14
13
DETAIL A
12
11
10
BOTTOM
0.80 BSC
9
VIEW
8
SEATING
PLANE
7
INDEX AREA
A1 CORNER
6
5
4
3
2
1
1.00 MAX
0.85 MIN
0.12 MAX
COPLANARITY
B
D
E
H
K
L
M
N
P
A
C
F
G
J
Package Option
BC-160-1
BC-160-1
BC-160-1
BC-160-1
AD9739